Manufacturer Part Number
CSD25304W1015T
Manufacturer
Texas Instruments
Introduction
Discrete Semiconductor Product
Single Transistor FET, MOSFET
Product Features and Performance
ROHS3 Compliant
6-DSBGA (1x1.5) Package
NexFET Series
Tape & Reel Packaging
Operating Temperature: -55°C ~ 150°C
Drain to Source Voltage (Vdss): 20V
Vgs (Max): ±8V
Rds On (Max) @ Id, Vgs: 32.5mOhm @ 1.5A, 4.5V
MOSFET (Metal Oxide) Technology
Current Continuous Drain (Id) @ 25°C: 3A
Input Capacitance (Ciss) (Max) @ Vds: 595 pF @ 10 V
Power Dissipation (Max): 750mW
P-Channel FET Type
Vgs(th) (Max) @ Id: 1.15V @ 250A
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.4 nC @ 4.5 V
Surface Mount Mounting Type
Product Advantages
RoHS3 Compliant
High performance NexFET technology
Small 6-DSBGA (1x1.5) package
Key Technical Parameters
Drain to Source Voltage (Vdss): 20V
Rds On (Max) @ Id, Vgs: 32.5mOhm @ 1.5A, 4.5V
Current Continuous Drain (Id) @ 25°C: 3A
Input Capacitance (Ciss) (Max) @ Vds: 595 pF @ 10 V
Power Dissipation (Max): 750mW
Quality and Safety Features
ROHS3 Compliant
Compatibility
Surface Mount
Application Areas
Suitable for a wide range of applications where high-performance, low-power dissipation P-Channel MOSFETs are required.
Product Lifecycle
Current product, no indication of discontinuation.
Key Reasons to Choose This Product
RoHS3 compliant
High performance NexFET technology
Small 6-DSBGA (1x1.5) package
Low Rds On and power dissipation
Wide operating temperature range (-55°C to 150°C)
Suitable for various applications requiring high-performance P-Channel MOSFETs.