Manufacturer Part Number
CY14B104NA-BA20XI
Manufacturer
Infineon Technologies
Introduction
A high-speed Non-Volatile SRAM from Infineon's memory portfolio, designed for high reliability and performance.
Product Features and Performance
Non-Volatile SRAM technology
High memory size of 4Mbit for extensive data storage
Parallel memory interface for efficient data transmission
Fast write cycle time and access time of 20ns for swift data handling
Operates over a wide voltage range of 2.7V to 3.6V
Product Advantages
Data retention without power due to Non-Volatile SRAM technology
Immediate non-volatile storage of data ensuring data integrity
Low power consumption enhances device efficiency
Suitable for critical data storage applications thanks to fast access times
Key Technical Parameters
Memory Type: NVSRAM
Memory Size: 4Mbit
Memory Organization: 256K x 16
Access Time: 20 ns
Write Cycle Time - Word, Page: 20ns
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Quality and Safety Features
Reliable data retention over a wide temperature range
Compliance with industrial safety and quality standards
Compatibility
Compatible with various microcontrollers and processors due to its parallel interface
Mountable on surface through 48-TFBGA packaging
Application Areas
Industrial automation systems
Networking equipment
Automotive electronics
Medical devices
Data logging systems
Product Lifecycle
The product is currently active, implying ongoing production and availability
No indication of nearing discontinuation, ensuring long-term availability for new designs
Several Key Reasons to Choose This Product
Immediate data storage provides assurance against data loss.
The high-speed operation enables efficient performance in critical applications.
Wide operating temperature range makes it suitable for harsh environments.
Low power consumption enhances the sustainability of the powered device.
4Mbit storage capacity allows for extensive data management and logging activities.
Compatibility with broad range of devices due to standardized interfaces and packaging.