CY14B104M-ZSP25XI - Infineon Technologies

Manufacturer Part Number

CY14B104M-ZSP25XI

Manufacturer

Infineon Technologies

Introduction

The CY14B104M-ZSP25XI is a high-speed Non-Volatile SRAM product with a memory size of 4Mbit.

Product Features and Performance

Non-Volatile Static Random Access Memory (NVSRAM)

High read/write endurance

4Mbit memory size

256K x 16 memory organization

Fast access time of 25ns

Fast write cycle time of 25ns

Supports parallel memory interface

7V to 3.6V power supply range

Operational temperature range from -40°C to 85°C

Surface mount 54-TSOP II package

Product Advantages

Retains data without power (non-volatile)

Provides reliable and fast performance

Suitable for demanding applications requiring quick data access

A robust operating temperature range ensures functionality in varied environments

Directly mountable on a printed circuit board

Key Technical Parameters

Memory Type: NVSRAM

Memory Size: 4Mbit

Access Time: 25ns

Supply Voltage: 2.7V to 3.6V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Manufactured by Infineon Technologies, known for high-quality products

Complies with industry-standard quality and safety specifications

Compatibility

Compatible with systems requiring a parallel memory interface

Interchangeable with other memory components respecting the mechanical and electrical specifications

Application Areas

Industrial automation and control systems

Automotive electronics

Networking hardware

Medical devices

Data storage systems

Product Lifecycle

Product Status: Active

Not nearing discontinuation

Replacement and upgrade options are often provided by Infineon Technologies

Several Key Reasons to Choose This Product

Infineon's reputation for producing reliable and durable memory components

The NVSRAM technology ensures data retention without power

Fast access and write cycles facilitate quick data storage and retrieval

Wide supply voltage range and operational temperature accommodates various power systems and environmental conditions

TSOP packaging is well-suited for dense PCB layouts

Ongoing product support and lifecycle management from Infineon Technologies