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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I Image
Image may be representation.
See specifications for product details.

XCZU9EG-L1FFVB1156I - AMD

Manufacturer Part Number
XCZU9EG-L1FFVB1156I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU9EG-L1FFVB1156I
ECAD Model
Parts Description
IC SOC CORTEX-A53 1156FCBGA
Detailed Description
Package
1156-BBGA, FCBGA
Data sheet
XCZU9EG-L1FFVB1156I.pdf
RoHs Status
ROHS3 Compliant
In stock: 9

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Quantity

Specifications

XCZU9EG-L1FFVB1156I Tech Specifications
AMD - XCZU9EG-L1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU9EG-L1FFVB1156I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 1156-FCBGA (35x35)  
Speed 500MHz, 600MHz, 1.2GHz  
Series Zynq® UltraScale+™ MPSoC EG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 1156-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Bulk  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of I/O 328  
Flash Size -  
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU9  
Architecture MCU, FPGA  

Parts Introduction

Manufacturer Part Number

XCZU9EG-L1FFVB1156I

Manufacturer

Xilinx

Introduction

The XCZU9EG-L1FFVB1156I is a cutting-edge Embedded System On Chip (SoC) from Xilinx's Zynq® UltraScale+™ MPSoC EG series, designed to cater to a broad range of demanding applications through its integration of a high-performance FPGA and a multi-core MCU.

Product Features and Performance

Combines a high-performance FPGA with a multi-core MCU

256KB RAM size for efficient processing

Includes peripherals such as DMA, WDT for enhanced functionality

Versatile connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Supports speeds of 500MHz, 600MHz, and 1.2GHz for optimal performance

Features over 599K+ Logic Cells for extensive programmability

Operates in a wide temperature range from -40°C to 100°C (TJ)

Product Advantages

Integration of MCU and FPGA offers unmatched versatility and computational power

Extensive connectivity options facilitate easy system integration and communication

High logic cell count presents vast design flexibility for complex applications

Wide operating temperature range ensures reliability in various environments

Key Technical Parameters

Architecture: MCU, FPGA

RAM Size: 256KB

Speed: 500MHz, 600MHz, 1.2GHz

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 1156-BBGA, FCBGA

Supplier Device Package: 1156-FCBGA (35x35)

Number of I/O: 328

Quality and Safety Features

Built to meet high-quality and safety standards requisite for demanding applications

Compatibility

Designed for broad compatibility with various peripherals and interfaces

Application Areas

Ideal for complex embedded systems in areas such as telecommunications, automotive, defense, and aerospace

Product Lifecycle

The product status is active, with no immediate indication of discontinuation. Continuous support and potential upgrades remain accessible.

Several Key Reasons to Choose This Product

Its integration of an FPGA and MCU in one SoC provides unparalleled processing power and flexibility.

Wide range of peripherals and connectivity options makes it highly versatile for various applications.

High logic cell count enables the handling of complex algorithms and processes.

Reliability is ensured by its operational capability in a broad temperature range.

Active product status guarantees long-term availability and support.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU9EG-L1FFVB1156I

Product Attribute XCZU9EG-L1FFVB1156I XCZU9EG-1FFVB1156I XCZU9CG-1FFVC900I XCZU6CG-1FFVC900I
Part Number XCZU9EG-L1FFVB1156I XCZU9EG-1FFVB1156I XCZU9CG-1FFVC900I XCZU6CG-1FFVC900I
Manufacturer AMD AMD AMD AMD
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM Size 256KB 256KB 256KB 256KB
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 1.2GHz 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Number of I/O 328 328 204 204
Base Product Number XCZU9 XCZU9 XCZU9 XCZU6
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Package Bulk Tray Tray Tray
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 900-FCBGA (31x31) 900-FCBGA (31x31)
Flash Size - - - -

XCZU9EG-L1FFVB1156I Datasheet PDF

Download XCZU9EG-L1FFVB1156I pdf datasheets and AMD documentation for XCZU9EG-L1FFVB1156I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU9EG-L1FFVB1156I

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32D-XCZU9EG-L1FFVB1156I

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