Manufacturer Part Number
XCZU7EV-2FBVB900I
Manufacturer
xilinx
Introduction
Embedded System On Chip (SoC) integrating MCU and FPGA
Product Features and Performance
Zynq® UltraScale+™ MPSoC EV series
Supports Multi-Processing with high-efficiency
504K+ Logic Cells for extensive programmability
Advanced signal processing with DSP slices
On-chip memory of 256KB RAM
Tray packaging for safe transportation
Integrated peripherals for versatile uses (DMA, WDT)
Product Advantages
High integration reduces system complexity
Versatile connectivity options including CANbus, Ethernet, and USB OTG
Customizable FPGA for tailored solutions
Robust temperature range for challenging environments
Key Technical Parameters
MCU and FPGA architecture
533MHz, 600MHz, 1.3GHz processing speeds
RAM Size: 256KB
Number of I/O: 204
Package / Case: 900-BBGA, FCBGA
Operating Temperature: -40°C to 100°C (TJ)
Quality and Safety Features
Constructed to operate reliably in a wide temperature range
Compatibility
Compatible with various industry-standard interfaces and protocols
Application Areas
Industrial automation
Data centers
Embedded computing
Medical equipment
Automotive
Product Lifecycle
Status: Active
Product longevity assured, updates on discontinuation will be provided
Several Key Reasons to Choose This Product
Optimal balance between power and performance
Scalability and customization to meet diverse project needs
Robust support and documentation from Xilinx
Readily available active product with commitment to future support
High-performance processing suited for data and compute-intensive applications