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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU9CG-2FFVB1156I
XCZU9CG-2FFVB1156I Image
Image may be representation.
See specifications for product details.

XCZU9CG-2FFVB1156I - AMD

Manufacturer Part Number
XCZU9CG-2FFVB1156I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU9CG-2FFVB1156I
ECAD Model
Parts Description
IC SOC CORTEX-A53 1156FCBGA
Detailed Description
Package
1156-BBGA, FCBGA
Data sheet
Zynq UltraScale+ MPSoC Overview.pdf
In stock: 15200

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Quantity

Specifications

XCZU9CG-2FFVB1156I Tech Specifications
AMD - XCZU9CG-2FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU9CG-2FFVB1156I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 1156-FCBGA (35x35)  
Speed 533MHz, 1.3GHz  
Series Zynq® UltraScale+™ MPSoC CG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 1156-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of I/O 328  
Flash Size -  
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU9  
Architecture MCU, FPGA  

Parts Introduction

Manufacturer Part Number

XCZU9CG-2FFVB1156I

Manufacturer

Xilinx

Introduction

This product is an Embedded System On Chip (SoC) from the Zynq® UltraScale+™ MPSoC CG series, designed to deliver high performance and functionality for embedded applications.

Product Features and Performance

Integrates a Dual ARM® Cortex®-A53 MPCore™ and Dual ARM®Cortex™-R5 processors for advanced multi-processing

Features 599K+ Logic Cells for extensive programmability

Withstands operating temperatures from -40°C to 100°C

Offers extensive connectivity including CANbus, Ethernet, I2C, and USB OTG

Speeds up to 533MHz for real-time processing and 1.3GHz for application processing

Product Advantages

High integration reduces system complexity and BOM cost

Suitable for high-performance and safety-critical applications due to dual-core ARM processors

Robust temperature range ensures reliability in extreme conditions

Versatile connectivity for a wide range of applications

Key Technical Parameters

Core Processor: Dual ARM® Cortex®-A53 and Dual ARM®Cortex™-R5

Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

Operating Temperature: -40°C ~ 100°C (TJ)

Speed: 533MHz, 1.3GHz

Number of I/O: 328

Quality and Safety Features

Engineered with CoreSight™ technology for advanced debugging capabilities

Built to meet stringent quality standards for safety-critical systems

Compatibility

Supports a range of standard communication interfaces like CANbus, Ethernet, and USB OTG

Compatible with a multitude of development tools and software from Xilinx

Application Areas

Ideal for applications in the automotive, aerospace, defense, and telecommunications industries

Suitable for embedded vision, IoT, and complex control systems

Product Lifecycle

Currently Active

Not nearing discontinuation, ensuring long-term availability and support

Several Key Reasons to Choose This Product

Integration of multiple ARM® cores offers a scalable solution for complex applications.

Extensive logic cell count allows for significant design flexibility.

Wide operating temperature range guarantees performance in harsh conditions.

Vast connectivity options support diverse application requirements.

Ongoing product support and active status ensure a reliable supply chain.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU9CG-2FFVB1156I

Product Attribute XCZU9CG-2FFVB1156I XCZU9CG-1FFVC900I XCZU9EG-L1FFVB1156I XCZU7EV-1FBVB900E
Part Number XCZU9CG-2FFVB1156I XCZU9CG-1FFVC900I XCZU9EG-L1FFVB1156I XCZU7EV-1FBVB900E
Manufacturer AMD AMD AMD AMD
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Supplier Device Package 1156-FCBGA (35x35) 900-FCBGA (31x31) 1156-FCBGA (35x35) 900-FCBGA (31x31)
Base Product Number XCZU9 XCZU9 XCZU9 XCZU7
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case 1156-BBGA, FCBGA 900-BBGA, FCBGA 1156-BBGA, FCBGA 900-BBGA, FCBGA
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EV
Number of I/O 328 204 328 204
Speed 533MHz, 1.3GHz 500MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz
Package Tray Tray Bulk Tray
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
RAM Size 256KB 256KB 256KB 256KB
Flash Size - - - -

XCZU9CG-2FFVB1156I Datasheet PDF

Download XCZU9CG-2FFVB1156I pdf datasheets and AMD documentation for XCZU9CG-2FFVB1156I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf
HTML Datasheet
Zynq UltraScale+ MPSoC Overview.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU9CG-2FFVB1156I

AMD
32D-XCZU9CG-2FFVB1156I

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