Manufacturer Part Number
XCZU7EV-2FFVC1156I
Manufacturer
Xilinx
Introduction
High-performance Embedded System on Chip with Multi-Processor Core and FPGA
Product Features and Performance
Integrated MCU and FPGA architecture
504K+ logic cells for FPGA
256KB onboard RAM
Multi-core processing with 533MHz, 600MHz, and 1.3GHz speed options
Rich set of peripherals for versatility, including DMA and WDT
High connectivity with CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
Product Advantages
Advanced processing power with a multi-core system
Scalable with FPGA integration for custom applications
Extensive connectivity options for various communication protocols
Robust design suitable for industrial applications with wide operating temperature range
Key Technical Parameters
1156-BBGA, FCBGA package
Operating temperature from -40°C to 100°C
High speed up to 1.3GHz for fast processing
Extensive I/O capabilities with 360 inputs/outputs
Quality and Safety Features
Designed to meet stringent industrial temperature requirements
Robust packaging for improved durability
Compatibility
Support for a broad spectrum of communication and interface standards
Application Areas
Ideal for sophisticated embedded systems in automotive, industrial, video surveillance, and aerospace sectors
Product Lifecycle
Currently active and not near discontinuation
Upgrade paths and replacement options anticipated per industry standards
Several Key Reasons to Choose This Product
Unmatched integration of CPU and FPGA capabilities
Superior processing speed and logic cell count enable complex computations
A wide range of peripherals and I/Os provide flexibility in design
Adaptability to harsh industrial environments with extended temperature range
Xilinx reliability and ongoing product support ensure long-term utility
XCZU7EV-2FBVB900IAMDIC SOC CORTEX-A53 900FCBGA