Manufacturer Part Number
XCZU7EV-1FBVB900I
Manufacturer
Xilinx
Introduction
Zynq UltraScale+ MPSoC EV family embedded system-on-chip (SoC)
Product Features and Performance
Integrated MCU and FPGA architecture
On-chip 256KB RAM
Multiple peripherals including DMA and WDT
Extensive connectivity with CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG
High-performance speeds of up to 1.2GHz
Zynq UltraScale+ FPGA with 504K+ logic cells
Supports a wide range of applications with versatile I/O options
Product Advantages
High integration reduces system complexity
Scalable processing power for versatile application demands
Robust peripheral set enables diverse communication protocols
Advanced FPGA capabilities for complex hardware acceleration
Key Technical Parameters
Architecture: MCU, FPGA
Flash Size: -
RAM Size: 256KB
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq UltraScale+ FPGA, 504K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Number of I/O: 204
Quality and Safety Features
Operational over a wide temperature range from -40°C to 100°C
Packaged in a 900-ball BGA for robust and reliable solder joints
Compatibility
Meets connectivity needs with a wide array of interfaces
900-FCBGA package compatible with standard PCB technologies
Application Areas
High-performance embedded applications
Industrial, automotive, and telecommunications
Defense and aerospace systems
Audio, video, and signal processing platforms
Product Lifecycle
Active status indicating ongoing production and support
Future-proof with potential for replacements or upgrades if necessary
Several Key Reasons to Choose This Product
Combination of high-speed processing and FPGA flexibility enhances design options
Variety of peripherals and interfaces facilitates diverse system integration
High logic cell count enables complex custom logic implementation
Active product life status ensures long-term utilization and support
Efficient design in a compact 900-FCBGA package maximizes board space