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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E Image
Image may be representation.
See specifications for product details.

XCZU6EG-2FFVB1156E - AMD

Manufacturer Part Number
XCZU6EG-2FFVB1156E
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU6EG-2FFVB1156E
ECAD Model
Parts Description
IC SOC CORTEX-A53 1156FCBGA
Detailed Description
Package
1156-BBGA, FCBGA
Data sheet
XCZU6EG-2FFVB1156E.pdf
RoHs Status
ROHS3 Compliant
In stock: 10

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Quantity

Specifications

XCZU6EG-2FFVB1156E Tech Specifications
AMD - XCZU6EG-2FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU6EG-2FFVB1156E

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 1156-FCBGA (35x35)  
Speed 533MHz, 600MHz, 1.3GHz  
Series Zynq® UltraScale+™ MPSoC EG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 1156-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature 0°C ~ 100°C (TJ)  
Number of I/O 328  
Flash Size -  
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU6  
Architecture MCU, FPGA  

Parts Introduction

Manufacturer Part Number

XCZU6EG-2FFVB1156E

Manufacturer

Xilinx

Introduction

The XCZU6EG-2FFVB1156E is a high-performance Embedded System On Chip (SoC) from Xilinx's Zynq® UltraScale+™ MPSoC EG series, integrating an MCU and FPGA for a multitude of applications.

Product Features and Performance

Combines high-performance ARM® Cortex® processors with FPGA logic on a single chip.

Features 469K+ Logic Cells for extensive programmability.

Provides a flexible and scalable processing platform with speeds up to 1.3GHz.

Includes a rich set of peripherals (DMA, WDT) and connectivity options (CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG) for versatile applications.

Supports advanced security features and power management options.

Product Advantages

Integrated MCU and FPGA significantly reduce system power consumption and design complexity.

High logic cell count enables the implementation of complex algorithms and systems on a single chip.

Extensive connectivity options allow for flexible designs catering to a wide range of applications.

Key Technical Parameters

Architecture: MCU, FPGA

RAM Size: 256KB

Speed: 533MHz, 600MHz, 1.3GHz

Operating Temperature: 0°C ~ 100°C (TJ)

Package / Case: 1156-BBGA, FCBGA

Number of I/O: 328

Quality and Safety Features

Designed to meet high standards of quality and reliability for professional and industrial applications.

Offers robust temperature and power management capabilities for enhanced safety.

Compatibility

Compatible with a wide array of interfaces and protocols, ensuring ease of integration into various designs and systems.

Application Areas

Ideal for use in advanced embedded applications such as automotive, aerospace, industrial control, telecommunications, and data processing.

Product Lifecycle

The product status is Active, indicating ongoing production and support with no immediate threat of discontinuation, ensuring long-term availability and support.

Several Key Reasons to Choose This Product

Integration of MCU and FPGA offers a compact, power-efficient solution.

High connectivity and programmability enable versatility across numerous applications.

Backed by Xilinx's robust support and long product lifecycle, ensuring a reliable solution for complex system designs.

The device operates efficiently within a wide temperature range, making it suitable for demanding environments.

High-performance features and extensive capabilities at the logic level allow for innovative, future-proof designs.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU6EG-2FFVB1156E

Product Attribute XCZU6EG-2FFVB1156E XCZU7EV-2FFVC1156I XCZU5EV-1SFVC784E XCZU9CG-1FFVC900I
Part Number XCZU6EG-2FFVB1156E XCZU7EV-2FFVC1156I XCZU5EV-1SFVC784E XCZU9CG-1FFVC900I
Manufacturer AMD AMD AMD AMD
Flash Size - - - -
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supplier Device Package 1156-FCBGA (35x35) 1156-FCBGA (35x35) 784-FCBGA (23x23) 900-FCBGA (31x31)
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Base Product Number XCZU6 XCZU7 XCZU5 XCZU9
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 784-BFBGA, FCBGA 900-BBGA, FCBGA
RAM Size 256KB 256KB 256KB 256KB
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC EV Zynq® UltraScale+™ MPSoC CG
Operating Temperature 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Speed 533MHz, 600MHz, 1.3GHz 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz 500MHz, 1.2GHz
Number of I/O 328 360 252 204
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Package Tray Tray Tray Tray

XCZU6EG-2FFVB1156E Datasheet PDF

Download XCZU6EG-2FFVB1156E pdf datasheets and AMD documentation for XCZU6EG-2FFVB1156E - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU6EG-2FFVB1156E

AMD
32D-XCZU6EG-2FFVB1156E

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