Manufacturer Part Number
XCKU035-1FBVA676I
Manufacturer
Xilinx
Introduction
Kintex UltraScale FPGA for next-generation performance
Product Features and Performance
Advanced DSP Slices
High-Performance SelectIO™
Next-Generation Block RAM
Integrated PCIe® Technology
Support for Multi-Gigabit Transceivers
Product Advantages
Optimized for high bandwidth and low latency
Scalable and flexible
Power-efficient architecture
High signal processing capacity
Key Technical Parameters
Number of LABs/CLBs: 25391
Number of Logic Elements/Cells: 444343
Total RAM Bits: 19456000
Number of I/O: 312
Voltage Supply: 0.922V ~ 0.979V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package/Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Quality and Safety Features
Strict manufacturing standards
High-temperature tolerance
Robust surface mount package
Compatibility
Compatible with UltraScale architecture
PCIe support for widespread integration
Application Areas
High-speed networking
Data center infrastructure
Broadcast video
Aerospace and Defense
Product Lifecycle
Active product
Not near discontinuation
Replacements or upgrades available under the UltraScale series
Key Reasons to Choose This Product
Powerful mix of on-chip resources for versatile applications
Capable of meeting the demands of high-bandwidth, low-latency projects
Proven reliability and performance at industrial temperature ranges
Active product with ongoing manufacturer support
Comprehensive compatibility with modern interfaces and protocols