Manufacturer Part Number
XCKU040-1FBVA676I
Manufacturer
Xilinx
Introduction
Kintex UltraScale FPGA for next-generation development
Product Features and Performance
30300 LABs/CLBs
530250 Logic Elements/Cells
21606000 Total RAM Bits
312 Number of I/O
Surface Mount
Product Advantages
High logic density
Advanced memory capabilities
Efficient power consumption
Key Technical Parameters
Voltage Supply 0.922V ~ 0.979V
Operating Temperature -40°C ~ 100°C (TJ)
676-BBGA, FCBGA Package
Supplier Device Package 676-FCBGA (27x27)
Quality and Safety Features
Extended operating temperature range
Robust ball grid array package
Compatibility
Compatible with a wide range of development tools and software
Application Areas
High-performance computing
Network processing
Data center applications
Aerospace and defense systems
Product Lifecycle
Active status
Updated replacements or upgrades may be available
Several Key Reasons to Choose This Product
High integration for complex projects
Support for advanced digital signal processing
Flexibility for product iterations and updates
Long product lifecycle with active status
Excellent performance-to-cost ratio
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