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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCKU035-2FBVA676E
XCKU035-2FBVA676E Image
Image may be representation.
See specifications for product details.

XCKU035-2FBVA676E - AMD

Manufacturer Part Number
XCKU035-2FBVA676E
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCKU035-2FBVA676E
ECAD Model
Parts Description
IC FPGA 312 I/O 676FCBGA
Detailed Description
Package
676-BBGA, FCBGA
Data sheet
Wireless Bluetooth® Low Energy Modules Overview.pdf
RoHs Status
ROHS3 Compliant
In stock: 18

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Quantity

Specifications

XCKU035-2FBVA676E Tech Specifications
AMD - XCKU035-2FBVA676E technical specifications, attributes, parameters and parts with similar specifications to AMD - XCKU035-2FBVA676E

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 0.922V ~ 0.979V  
Total RAM Bits 19456000  
Supplier Device Package 676-FCBGA (27x27)  
Series Kintex® UltraScale™  
Package / Case 676-BBGA, FCBGA  
Package Bulk  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 100°C (TJ)  
Number of Logic Elements/Cells 444343  
Number of LABs/CLBs 25391  
Number of I/O 312  
Mounting Type Surface Mount  
Base Product Number XCKU035  

Parts Introduction

Manufacturer Part Number

XCKU035-2FBVA676E

Manufacturer

Xilinx

Introduction

The XCKU035-2FBVA676E is a Kintex® UltraScale™ FPGA that offers superior performance and capacity for a range of embedded applications.

Product Features and Performance

High logic capacity with 444,343 logic elements/cells

25,391 LABs/CLBs facilitating complex digital computations

19,456,000 total RAM bits enhancing memory capabilities

Supports 312 I/O pins ensuring extensive peripheral connectivity

Operates within a supply voltage of 0.922V to 0.979V

Product Advantages

High logic to RAM ratio optimized for efficient data handling and processing speed

Enhanced signal integrity with advanced packaging technology

Key Technical Parameters

Number of Logic Elements/Cells: 444,343

Total RAM Bits: 19,456,000

Number of I/O: 312

Operating Voltage: 0.922V ~ 0.979V

Operating Temperature: 0°C ~ 100°C (TJ)

Quality and Safety Features

Robust surface mount package (676-FCBGA)

Temperature grade allowing for operation in varying environmental conditions

Compatibility

Compatible with multiple standard voltage and signal interfaces

Application Areas

Telecommunications

Data processing

Industrial applications

Medical imaging systems

Product Lifecycle

Product status is active

Continual support and availability with potential future upgrades

Several Key Reasons to Choose This Product

High integration capability with over 444K logic cells

Advanced thermal management suitable for high-performance environments

Expanded connectivity options with over 300 I/Os

Stable and reliable operation within defined voltage and temperature ranges

Suitable for next-generation technology requirements in various high-demand sectors

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCKU035-2FBVA676E

Product Attribute XCKU035-2FBVA676E XCKU025-2FFVA1156I XCKU035-L1FFVA1156I XCKU035-2FBVA900E
Part Number XCKU035-2FBVA676E XCKU025-2FFVA1156I XCKU035-L1FFVA1156I XCKU035-2FBVA900E
Manufacturer AMD AMD Xilinx AMD
Operating Temperature 0°C ~ 100°C (TJ) - -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Voltage - Supply 0.922V ~ 0.979V - 0.880 V ~ 0.979 V 0.922V ~ 0.979V
Number of Logic Elements/Cells 444343 - 444343 444343
Number of LABs/CLBs 25391 - 25391 25391
Package / Case 676-BBGA, FCBGA - 1156-BBGA, FCBGA 900-BBGA, FCBGA
Number of I/O 312 - 520 468
Total RAM Bits 19456000 - 19456000 19456000
Package Bulk - - Bulk
Series Kintex® UltraScale™ - Kintex® UltraScale™ Kintex® UltraScale™
Base Product Number XCKU035 - - XCKU035
Mounting Type Surface Mount - Surface Mount Surface Mount
Supplier Device Package 676-FCBGA (27x27) - 1156-FCBGA (35x35) 900-FCBGA (31x31)

XCKU035-2FBVA676E Datasheet PDF

Download XCKU035-2FBVA676E pdf datasheets and AMD documentation for XCKU035-2FBVA676E - AMD.

Datasheets
Wireless Bluetooth® Low Energy Modules Overview.pdf
Environmental Information
Xilinx REACH211 Cert.pdf
PCN Design/Specification
Ultrascale & Virtex Dev Spec Chg 20/Dec/2016.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCKU035-2FBVA676E

AMD
32D-XCKU035-2FBVA676E

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