Manufacturer Part Number
XCKU035-2FBVA676I
Manufacturer
Xilinx
Introduction
High-performance Kintex UltraScale FPGA for advanced embedded systems
Product Features and Performance
Low-power Kintex® UltraScale™ architecture
25391 Logic Blocks (LABs)/CLBs
444343 Logic Elements/Cells
456 Mbit of total RAM
312 I/O pins
Supported by Vivado Design Suite
Product Advantages
Optimized for next-generation higher-performing, lower-power integrated systems
Advanced on-chip memory to handle complex designs
High signal processing bandwidth suitable for multi-protocol wireless connectivity
Key Technical Parameters
Supply Voltage: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Surface Mount technology
676-BBGA, FCBGA packaging
Bulk packaging for large-scale deployment
Quality and Safety Features
Robust design for industry-grade reliability and safety
Stringent quality control consistent with Xilinx manufacturing standards
Compatibility
Compatible with the Vivado Design Suite for design synthesis and Analysis
Backward compatible with earlier generation Kintex FPGAs for design scalability
Application Areas
Aerospace and Defense
Data Centers and Servers
Broadcast, Professional A/V
Wired and Wireless Networks
Medical Imaging
Product Lifecycle
Product is currently in active status
Not near discontinuation with ongoing manufacturer support
Several Key Reasons to Choose This Product
High-density logic available in a mid-range FPGA
Designed for scalable performance in embedded systems
Adaptable to a wide range of applications and industries
Long-term reliability and product support from Xilinx
Enhanced thermal performance for challenging environments
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