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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCKU040-1FBVA676C
XCKU040-1FBVA676C Image
Image may be representation.
See specifications for product details.

XCKU040-1FBVA676C - AMD

Manufacturer Part Number
XCKU040-1FBVA676C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCKU040-1FBVA676C
ECAD Model
Parts Description
IC FPGA 312 I/O 676FCBGA
Detailed Description
Package
676-BBGA, FCBGA
Data sheet
Wireless Bluetooth® Low Energy Modules Overview.pdf
Kintex® UltraScale™ FPGA Datasheet.pdf
RoHs Status
ROHS3 Compliant
In stock: 21

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Quantity

Specifications

XCKU040-1FBVA676C Tech Specifications
AMD - XCKU040-1FBVA676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XCKU040-1FBVA676C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 0.922V ~ 0.979V  
Total RAM Bits 21606000  
Supplier Device Package 676-FCBGA (27x27)  
Series Kintex® UltraScale™  
Package / Case 676-BBGA, FCBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 530250  
Number of LABs/CLBs 30300  
Number of I/O 312  
Mounting Type Surface Mount  
Base Product Number XCKU040  

Parts Introduction

Manufacturer Part Number

XCKU040-1FBVA676C

Manufacturer

Xilinx

Introduction

FPGA from Kintex® UltraScale™ family offering high performance for embedded systems.

Product Features and Performance

30300 LABs/CLBs.

530250 Logic Elements/Cells.

21606000 Total RAM Bits.

312 Number of I/O.

Surface Mount Technology.

Flexible programming capabilities.

Product Advantages

Optimized for high-performance applications.

Large number of logic cells and I/Os.

Advanced memory architecture.

Key Technical Parameters

Voltage - Supply: 0.922V ~ 0.979V.

Operating Temperature: 0°C ~ 85°C.

Package/Case: 676-BBGA, FCBGA.

Supplier Device Package: 676-FCBGA (27x27).

Quality and Safety Features

Designed to meet high-quality and safety standards.

Reliable performance within specified temperature range.

Compatibility

Compatible with mainstream design software.

Interoperable with other devices in the UltraScale™ series.

Application Areas

Data processing.

Telecommunications.

Industrial automation.

High-speed networking.

Product Lifecycle

Status: Active.

Long-term availability.

No immediate discontinuation expected.

Several Key Reasons to Choose This Product

High logic and I/O capacity for complex designs.

Robust memory resources for data-intensive tasks.

Efficient power supply for reduced energy costs.

Durable and reliable within a broad temperature range.

Advanced manufacturing technology for reduced footprint.

Strong support and documentation from Xilinx.

Compatibility with leading-edge design tools.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCKU040-1FBVA676C

Product Attribute XCKU040-1FBVA676C XCKU035-2FBVA900E XCKU040-2FBVA676I XCKU040-1FFVA1156C
Part Number XCKU040-1FBVA676C XCKU035-2FBVA900E XCKU040-2FBVA676I XCKU040-1FFVA1156C
Manufacturer AMD AMD AMD AMD
Number of Logic Elements/Cells 530250 444343 530250 530250
Total RAM Bits 21606000 19456000 21606000 21606000
Number of LABs/CLBs 30300 25391 30300 30300
Base Product Number XCKU040 XCKU035 XCKU040 XCKU040
Supplier Device Package 676-FCBGA (27x27) 900-FCBGA (31x31) 676-FCBGA (27x27) 1156-FCBGA (35x35)
Package / Case 676-BBGA, FCBGA 900-BBGA, FCBGA 676-BBGA, FCBGA 1156-BBGA, FCBGA
Voltage - Supply 0.922V ~ 0.979V 0.922V ~ 0.979V 0.922V ~ 0.979V 0.922V ~ 0.979V
Series Kintex® UltraScale™ Kintex® UltraScale™ Kintex® UltraScale™ Kintex® UltraScale™
Package Tray Bulk Tray Tray
Number of I/O 312 468 312 520
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount

XCKU040-1FBVA676C Datasheet PDF

Download XCKU040-1FBVA676C pdf datasheets and AMD documentation for XCKU040-1FBVA676C - AMD.

Datasheets
Wireless Bluetooth® Low Energy Modules Overview.pdf
Environmental Information
Xilinx REACH211 Cert.pdf
PCN Design/Specification
Ultrascale & Virtex Dev Spec Chg 20/Dec/2016.pdf Quality Alert 24/Nov/2015.pdf
HTML Datasheet
Kintex® UltraScale™ FPGA Datasheet.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCKU040-1FBVA676C

AMD
32D-XCKU040-1FBVA676C

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