Manufacturer Part Number
XCKU040-2FFVA1156I
Manufacturer
Xilinx
Introduction
Embedded Field-Programmable Gate Array for high-performance applications
Product Features and Performance
High logic integration with 530250 logic elements
Large number of configurable logic blocks (CLBs) at 30300
Substantial memory capacity with 21606000 total RAM bits
Abundant I/O options with 520 I/O pins
Support for a wide range of supply voltages from 0.922V to 0.979V
Surface mount technology for solid board attachment
Optimal for challenging environments with an operating temperature range of -40°C to 100°C
Kintex® UltraScale™ series offers advance signal processing capabilities
Designed for high-throughput and high-bandwidth applications
Product Advantages
Optimized for both cost and power, enhancing overall efficiency
Robust thermal performance for reliability in varied environments
Flexible power supply voltage for compatibility with various system designs
Ample I/O and logic resources to accommodate complex designs without additional components
Key Technical Parameters
Number of LABs/CLBs: 30300
Number of Logic Elements/Cells: 530250
Total RAM Bits: 21606000
Number of I/O: 520
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Quality and Safety Features
Subject to rigorous testing to meet industry standards
Designed to operate reliably in extreme temperatures
Manufacturing and materials conform to high-quality standards
Compatibility
Compatible with standard surface mount processes
Supports various voltage levels for interfacing with different system components
Can be used in systems with other Xilinx UltraScale devices
Application Areas
Data centers and cloud computing
Wired communications
Broadcasting and multimedia
Aerospace and defense systems
Industrial control and automation
Product Lifecycle
Active status indicating current production with ongoing manufacturer support
Replacements or upgrades may exist within the UltraScale™ product family
Several Key Reasons to Choose This Product
High-density integration reduces the need for multiple chips
Lower power consumption without compromising performance
Flexibility to adapt to a variety of voltage requirements
Robust construction suitable for a wide temperature range
Supported by Xilinx's comprehensive design tools
Backed by a leading manufacturer in the FPGA market
Extended lifecycle and support for future-proofing systems