Manufacturer Part Number
XCKU025-1FFVA1156C
Manufacturer
Xilinx
Introduction
Kintex® UltraScale™ FPGA for high-performance applications in data processing and computing
Product Features and Performance
Large number of logic cells: 318,150
Extensive memory resources: 13,004,800 total RAM bits
Efficient interconnect and high I/O pin count: 312 I/Os
High signal processing capability
Superior mixed-signal integration
Improved system performance and reduced BOM cost
Support for high-speed transceivers
Product Advantages
Advanced technology node offering better performance/watt
Scalable and cost-effective
High reliability and long-term availability
Key Technical Parameters
Number of LABs/CLBs: 18,180
Voltage supply range: 0.922V ~ 0.979V
TJ Operating Temperature: 0°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Quality and Safety Features
In-built error detection and correction
Robust thermal management
Comprehensive security features
Stringent quality control processes
Compatibility
Compatible with industry-standard design suites
Accessible development tools and IP cores
Seamless migration path for legacy designs
Application Areas
Data center and cloud computing
Wired and wireless communications
Industrial Control and automation
Medical imaging and diagnostic equipment
Aerospace and Defense systems
Product Lifecycle
Active product status
Ongoing support and updates available
Long-term product availability
Future path for upgrades and next-generation devices
Several Key Reasons to Choose This Product
High-performance design capabilities for advanced systems
Versatility in a wide range of applications and markets
Energy-efficient operation at leading-edge process nodes
Robust support infrastructure from Xilinx
Proven track record of reliability and customer support
Ease of integration with other system components
Availability of comprehensive development tools and resources
XCKU035-2FBVA900EAMDIC FPGA 468 I/O 900FCBGA