Manufacturer Part Number
XC7Z035-2FFG676E
Manufacturer
xilinx
Introduction
The XC7Z035-2FFG676E is a system-on-chip (SoC) from Xilinx's Zynq®-7000 series, which uniquely combines the software programmability of a processor with the hardware programmability of an FPGA.
Product Features and Performance
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ technology for efficient multitasking.
Integrated Kintex™-7 FPGA with 275K logic cells for high-density logic applications.
Supports a wide range of connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG.
256KB RAM for data storage and processing.
Operates at 800MHz providing robust speed for high-performance applications.
DMA peripherals enabling faster data transfer between devices.
Product Advantages
Enhanced processing power with dual ARM® Cortex®-A9 cores.
High configurability and customization possible due to the integrated FPGA.
Broad connectivity support meets various system integration requirements.
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
RAM Size: 256KB
Number of I/O: 130
Operating Temperature: 0°C ~ 100°C (TJ)
Quality and Safety Features
Robust operating temperature range from 0°C to 100°C ensuring stability in varied environmental conditions.
Packaged in a 676-pin FCBGA package providing enhanced thermal properties and reliability.
Compatibility
Compatible with various industry-standard interfaces and protocols, ensuring ease of integration into existing systems.
Application Areas
Industrial automation
Embedded computing
Medical devices
Telecommunications
Automotive electronics
Product Lifecycle
Currently in active production.
Not nearing discontinuation, availability of ongoing support and upgrades.
Several Key Reasons to Choose This Product
Dual ARM® Cortex® integrated processors facilitate complex and power-efficient computing.
Extensive logic cell capacity suitable for substantial customization and high-density logic applications.
Comprehensive connectivity options enable versatility in application and system design.
Operates reliably in a broad range of temperatures making it suitable for harsh environment applications.
Continued product lifecycle support ensuring long-term usability and return on investment.
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