XC7Z035-1FFG900I - AMD

Manufacturer Part Number

XC7Z035-1FFG900I

Manufacturer

Xilinx

Introduction

The XC7Z035-1FFG900I belongs to the Zynq®-7000 series and is a robust embedded system on a chip (SoC) that combines the software programmability of a processor with the hardware programmability of an FPGA.

Product Features and Performance

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Kintex™-7 FPGA with 275K Logic Cells

Rich set of peripherals including DMA

Comprehensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

High processing speed of 667MHz

Product Advantages

Integrated MCU and FPGA architecture for flexible hardware-software application development

High-density I/O with 130 pins for extensive external interfacing

Robust operating temperature range from -40°C to 100°C

Key Technical Parameters

Core Processor: Dual ARM® Cortex®-A9

Speed: 667MHz

Logic Cells: 275K

RAM: 256KB

Operating Temperature: -40°C ~ 100°C (TJ)

Number of I/O: 130

Quality and Safety Features

Manufactured in a high-standard 900-BBGA, FCBGA package to ensure durability and reliability under extreme conditions

Compatibility

Compatible with multiple standards of connectivity and has a broad range of interfaces for diverse application requirements

Application Areas

Ideal for industrial, automotive, video surveillance, and aerospace sectors due to its robustness and versatile connectivity

Product Lifecycle

Currently classified as an active product

No immediate plans for discontinuation, ensuring long-term availability and support

Several Key Reasons to Choose This Product

Highly integrated SoC with dual-core ARM processor and FPGA provides massive parallel processing capacity

Extensive I/O capabilities facilitate connections with various industrial modules and sensors

Withstands extreme temperatures making it suitable for tough environments

Continued product support and availability ensure a reliable investment for future developments