Manufacturer Part Number
XC7Z035-2FBG676E
Manufacturer
Xilinx
Introduction
The XC7Z035-2FBG676E is part of Xilinx's Zynq®-7000 series, combining the functionality of an MCU with the flexibility of an FPGA into a single Embedded System On Chip (SoC).
Product Features and Performance
Integrates Dual ARM® Cortex®-A9 MPCore™ processors with CoreSight™ technology
Features Kintex™-7 FPGA architecture with 275K logic cells
Supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
Operates at speeds up to 800MHz
Provides 256KB of on-chip RAM for fast data storage and processing
Packaged in a 676-ball Fine-Pitch Ball Grid Array (FBGA) for robust physical integration
Product Advantages
The dual-core ARM Cortex-A9 processors offer high processing power for complex computations
Kintex-7 FPGA enables high levels of customization and flexibility in design
Extensive connectivity options facilitate integration into a wide range of systems and networks
High operation speed and substantial logic capacity make it suitable for demanding applications
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Logic Cells: 275K
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Number of I/O: 130
Quality and Safety Features
Manufactured by Xilinx, a leader in semiconductor design and production
Meets industry standards for quality and reliability
Operates within a wide temperature range ensuring stability in varied environments
Compatibility
Compatible with a broad range of standard peripherals and interfaces due to its extensive connectivity options
Easily integrated with existing systems and architectures thanks to its flexible design
Application Areas
Industrial automation and control systems
Advanced driver-assistance systems (ADAS)
Wireless communication infrastructure
High-performance computing applications
Aerospace and defense systems
Product Lifecycle
Currently marked as Active, indicating availability and support
Ongoing manufacturer support for development, ensuring long-term usability
Several Key Reasons to Choose This Product
High integration of MCU and FPGA functions reduces system complexity and cost
Powerful dual-core ARM processor combined with a high-capacity FPGA offers unparalleled flexibility and performance
Wide connectivity and temperature range expand the application possibilities
Backed by Xilinx's reputation for quality and support, ensuring reliability and longevity in deployments
Current product status ensures continued availability and support for future projects
XC7Z035-2FBG676CAMD Xilinx
XC7Z035-1FFG676CAMDIC SOC CORTEX-A9 667MHZ 676FCBGA