Manufacturer Part Number
XC7Z035-2FFG900I
Manufacturer
Xilinx
Introduction
The XC7Z035-2FFG900I, part of Xilinx’s Zynq®-7000 series, combines the power of Dual ARM® Cortex®-A9 MPCore™ CPUs with the flexibility of Kintex™-7 FPGA, making it a robust System On Chip (SoC) for embedded applications.
Product Features and Performance
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Kintex™-7 FPGA with 275K Logic Cells
256KB RAM Size
DMA Peripherals
Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed up to 800MHz
Operating Temperature range from -40°C to 100°C (TJ)
Product Advantages
High processing power due to Dual ARM® Cortex®-A9 cores
Flexible and high-capacity FPGA for a wide array of applications
Comprehensive connectivity options for versatile interfacing
Robust performance in a wide temperature range
Key Technical Parameters
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Flash Size: -
RAM Size: 256KB
Speed: 800MHz
Operating Temperature: -40°C ~ 100°C (TJ)
Package: 900-BBGA, FCBGA
I/O Number: 130
Quality and Safety Features
Designed for high reliability and enhanced performance within the specified temperature range
Compatibility
Broad compatibility with a multitude of interfaces and peripherals for embedded systems
Application Areas
Industrial Automation
Automotive Systems
Telecommunications
Defense and Aerospace
Consumer Electronics
Product Lifecycle
Active Product Status ensures ongoing production and support
Highly unlikely to be nearing discontinuation, providing reliability for long-term projects
Several Key Reasons to Choose This Product
Dual-processing capability that merges high-speed ARM® cores with flexible FPGA logic
Robust connectivity options meet diverse system requirements
Highly reliable architecture ensuring operation in challenging conditions
Active product lifecycle status ensures long-term support and availability
Ideal solution for demanding applications where performance and flexibility are crucial
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