XC7Z035-2FBG676I - AMD

Manufacturer Part Number

XC7Z035-2FBG676I

Manufacturer

Xilinx

Introduction

The XC7Z035-2FBG676I is a high-performance System on Chip (SoC) integrating both processor and FPGA architectures, from the Zynq®-7000 series, designed for advanced embedded applications.

Product Features and Performance

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ enabling efficient multitasking

Kintex™-7 FPGA fabric featuring 275K logic cells for extensive programmability

Speed of 800MHz ensuring rapid data processing

High connectivity with CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

256KB RAM facilitating adequate temporary data storage

Product Advantages

Unified architecture blending processor and FPGA for enhanced flexibility and performance

Robust connectivity options supporting a wide range of communication protocols

Key Technical Parameters

Core Processor: Dual ARM® Cortex®-A9

Speed: 800MHz

Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells

Operating Temperature: -40°C to 100°C

Package: 676-FCBGA, footprint 27x27

Number of I/O: 130

Quality and Safety Features

Designed with advanced technology for operation within industrial temperature ranges from -40°C to 100°C

Compatibility

Supports various communication protocols making integration with existing systems effortless

Application Areas

Ideal for industrial automation, medical equipment, communication infrastructure, and automotive systems

Product Lifecycle

This product is currently active with no impending discontinuation, ensuring long-term availability and support

Several Key Reasons to Choose This Product

Advanced dual-core ARM Cortex-A9 processors facilitating high-performance multitasking

FPGA integration offers extensive customization and adaptability for various applications

Supports a wide temperature range ensuring reliability in harsh environments

High-speed operation at 800MHz for fast and efficient processing

Abundant connectivity options to meet diverse system requirements