Manufacturer Part Number
XC7Z035-1FBG676I
Manufacturer
Xilinx
Introduction
Integrated SoC combining ARM processing with Xilinx FPGA technology
Product Features and Performance
Dual ARM Cortex-A9 MPCore with CoreSight
Kintex-7 FPGA with 275K Logic Cells
Array of peripherals for multi-functional integration
High-speed connectivity interfaces
Product Advantages
Efficient system integration with processing and FPGA capabilities
Ideal for dynamic and complex embedded systems
Scalable processing power
Key Technical Parameters
Dual ARM Cortex-A9 cores at 667MHz
256KB RAM
Multiple connectivity options – CANbus, EBI/EMI, Ethernet, etc.
676-pin FCBGA package
130 I/O pins
Quality and Safety Features
Extended operating temperature range from -40°C to 100°C
Robust package for reliable embedded systems deployment
Compatibility
Supports a variety of interfaces and protocols
Compatible with Xilinx development and software tools
Application Areas
Automotive
Industrial control systems
Telecommunications
Defense and aerospace
Product Lifecycle
Active status
Not near discontinuation
Longevity support with potential for future upgrades
Several Key Reasons to Choose This Product
High integration for reduced system complexity and cost
Versatile for various demanding applications
Proven technology from a reliable semiconductor manufacturer
Comprehensive technical support and documentation
Optimized for both processing efficiency and design flexibility
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