Manufacturer Part Number
XC7Z030-3FBG676E
Manufacturer
Xilinx
Introduction
The XC7Z030-3FBG676E is a high-performance System on Chip (SoC) from Xilinx's Zynq®-7000 series, integrating Dual ARM® Cortex®-A9 processors with Kintex™-7 FPGA technology.
Product Features and Performance
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
125K Logic Cells FPGA from Kintex™-7 series
High connectivity options including CANbus, Ethernet, I2C, and USB OTG
Operating speed of 1GHz
On-chip DMA for data-driven performance
Product Advantages
Integration of processor and FPGA reduces system power consumption and complexity
Enhanced processing power suitable for multipurpose applications
Scalable and high-performance connectivity and peripherals options
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9 MPCore™
Speed: 1GHz
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG
Number of I/O: 130
Operating Temperature: 0°C ~ 100°C
Quality and Safety Features
Reliability under a range of operating temperatures from 0°C to 100°C
Advanced packaging technology ensures robustness
Compatibility
Compatible with a range of development and production software from Xilinx and other vendors
Application Areas
Industrial Automation
Multimedia
Automotive
Data Communication
Product Lifecycle
Product is currently active
Not nearing discontinuation, with availability of replacements or upgrades in the Zynq®-7000 series
Reasons to Choose This Product
High integration of CPU and configurable FPGA offers versatility in application design
Robust I/O and connectivity features suitable for complex industrial applications
High operation speed of 1GHz for high-performance computing needs
Reliable and durable design suitable for demanding environments
Continued support and product lifecycle assurance from Xilinx