Manufacturer Part Number
XC7Z030-2FFG676E
Manufacturer
Xilinx
Introduction
The XC7Z030-2FFG676E is an Embedded System On Chip (SoC) from Xilinx's Zynq®-7000 series, combining the performance and power efficiency of an MCU with the flexibility and scalability of an FPGA.
Product Features and Performance
Incorporates Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Kintex™-7 FPGA with 125K Logic Cells for robust performance
Versatile connectivity including CANbus, Ethernet, I2C, and more
256KB RAM for efficient data handling and processing
High operational speed of 800MHz
Supports a wide range of peripherals such as DMA for enhanced functionality
Product Advantages
Integrated MCU and FPGA architecture provides a highly flexible and powerful platform
High-speed connectivity options cater to a wide range of application needs
Suitable for high-temperature operations up to 100°C (TJ)
Comprehensive CoreSight™ debug and trace capability for simplified development and troubleshooting
Key Technical Parameters
Core Processor: Dual ARM® Cortex®-A9
Operating Speed: 800MHz
Logic Cells: 125K
RAM Size: 256KB
Number of I/O: 130
Operating Temperature Range: 0°C ~ 100°C (TJ)
Package: 676-BBGA, FCBGA
Quality and Safety Features
Built to meet rigorous quality and safety standards for reliability in demanding applications
Integrated features to support secure development and deployment
Compatibility
Wide interface support ensures compatibility with numerous peripheral types and existing systems
Flexible I/O options for seamless integration into varied design requirements
Application Areas
Ideal for high-performance embedded applications across industries such as automotive, aerospace, defense, and telecommunications
Suited for advanced robotics, smart vision systems, and next-generation wireless infrastructure
Product Lifecycle
Currently marked as Active, indicating availability and ongoing support
No immediate discontinuation, ensuring long-term availability for system designs
Several Key Reasons to Choose This Product
Integration of MCU and FPGA capabilities offers unmatched versatility and power efficiency
Broad connectivity and peripheral support address a variety of design requirements
High-speed operation and ample logic capacity make it suitable for complex, demanding applications
Robust temperature and quality standards ensure reliability in challenging environments
Long product lifecycle and active status provide assurance for future-oriented projects