on November 12th 58

USB3300 Transceiver: Datasheet, Pinout, and Specifications

The USB3300 stands as a high-performance USB transceiver engineered to maintain exceptional stability and functionality across diverse thermal environments. Central to modern electronic designs, it offers a detailed exploration of its capabilities, pin specifications, and technical parameters, empowering designers to fully leverage its potential in a variety of applications. This article delves into the intricacies of the USB3300, showcasing its importance in enhancing connectivity and performance in electronics today.

Catalog

What is the USB3300?

The USB3300 transceiver is an important part for handling high-speed USB connections and can work well in extreme temperatures. It uses a low-pin ULPI interface, which makes it easy to connect with other ULPI-compatible devices. This new design reduces the number of pins needed, from 54 in the older UTMI+ interface down to just 12. This improvement means there’s no need for complicated UTMI-to-ULPI adapters, allowing for faster data transfers with less delay. The USB3300 also supports different modes, device, host, and OTG (On-The-Go) which gives more flexibility to add host or OTG features as they build their products. The USB3300 can easily switch between device, host, and OTG modes, making it a versatile option for a wide range of uses, from simple USB accessories to complex host systems. This flexibility allows to build USB systems that can change roles depending on the need, which is increasingly useful for modern electronics. Components that can adapt in this way tend to last longer in the market compared to less flexible alternatives. With Microchip’s advanced technology in a compact package, adding high-speed USB to new designs is simpler and faster. The USB3300 requires few extra components and has built-in termination resistors, which further eases integration. By focusing on simplicity and high integration, you can spend more time on innovation rather than managing complex components. This streamlined approach speeds up development, reduces design errors, and improves product reliability, helping products succeed in the marketplace.

USB3300 Pin Configuration

Pin No	Pin Name	Description
1	GND	Ground
2	GND	Ground
3	CPEN	External 5 volt supply enable. This pin is used to enable the external Vbus power supply. The CPEN pin is low on POR.
4	VBUS	VBUS pin of the USB cable. The USB3300 uses this pin for the Vbus comparator inputs and for Vbus pulsing during session request protocol.
5	ID	ID pin of the USB cable. For non-OTG applications this pin can be floated. For an A-Device ID = 0. For a B-Device ID = 1.
6	VDD3.3	3.3V Supply. A 0.1uF bypass capacitor should be connected between this pin and the ground plane on the PCB.
7	DP	D+ pin of the USB cable.
8	DM	D- pin of the USB cable.
9	RESET	Optional active high transceiver reset. This is the same as a write to the ULPI Reset, address 04h, bit 5. This does not reset the ULPI register set. This pin includes an integrated pull-down resistor to ground. If not used, this pin can be floated or connected to ground (recommended).
10	EXTVBUS	External Vbus Detect. Connect to fault output of an external USB power switch or an external Vbus Valid comparator. This pin has a pull down resistor to prevent it from floating when the ULPI bit UseExternalVbusIndicator is set to 0.
11	NXT	The PHY asserts NXT to throttle the data. When the Link is sending data to the PHY, NXT indicates when the current byte has been accepted by the PHY. The Link places the next byte on the data bus in the following clock cycle.
12	DIR	Controls the direction of the data bus. When the PHY has data to transfer to the Link, it drives DIR high to take ownership of the bus. When the PHY has no data to transfer it drives DIR low and monitors the bus for commands from the Link. The PHY will pull DIR high whenever the interface cannot accept data from the Link, such as during PLL start-up.
13	STP	The Link asserts STP for one clock cycle to stop the data stream currently on the bus. If the Link is sending data to the PHY, STP indicates the last byte of data was on the bus in the previous cycle.
14	CLKOUT	60MHz reference clock output. All ULPI signals are driven synchronous to the rising edge of this clock.
15	VDD1.8	1.8V for digital circuitry on chip. Supplied by On-Chip Regulator when REG_EN is active. Place a 0.1uF capacitor near this pin and connect the capacitor from this pin to ground. Connect pin 15 to pin 26.
16	VDD3.3	A 0.1uF bypass capacitor should be connected between this pin and the ground plane on the PCB.
17	DATA[7]	8-bit bi-directional data bus. Bus ownership is determined by DIR. The Link and PHY initiate data transfers by driving a non-zero pattern onto the data bus. ULPI defines interface timing for a single-edge data transfers with respect to rising edge of CLKOUT. DATA[7] is the MSB and DATA[0] is the LSB.
18	DATA[6]
19	DATA[5]
20	DATA[4]
21	DATA[3]
22	DATA[2]
23	DATA[1]
24	DATA[0]
25	VDD3.3	A 0.1uF bypass capacitor should be connected between this pin and the ground plane on the PCB.
26	VDD1.8	1.8V for digital circuitry on chip. Supplied by On-Chip Regulator when REG_EN is active. When using the internal regulators, place a 4.7uF low-ESR capacitor near this pin and connect the capacitor from this pin to ground. Connect pin 26 to pin 15. Do not connect VDD1.8 to VDDA1.8 when using internal regulators. When the regulators are disabled, pin 29 may be connected to pins 26 and 15.
27	XO	Crystal pin. If using an external clock on XI this pin should be floated.
28	XI	Crystal pin. A 24MHz crystal is supported. The crystal is placed across XI and XO. An external 24MHz clock source may be driven into XI in place of a crystal.
29	VDDA1.8	1.8V for analog circuitry on chip. Supplied by On-Chip Regulator when REG_EN is active. Place a 0.1uF capacitor near this pin and connect the capacitor from this pin to ground. When using the internal regulators, place a 4.7uF low-ESR capacitor near this pin in parallel with the 0.1uF capacitor. Do not connect VDD1.8A to VDD1.8 when using internal regulators. When the regulators are disabled, pin 29 may be connected to pins 26 and 15.
30	VDD3.3	Analog 3.3 volt supply. A 0.1uF low ESR bypass capacitor connected to the ground plane of the PCB is recommended.
31	REG_EN	On-Chip 1.8V regulator enable. Connect to ground to disable both of the on chip (VDDA1.8 and VDD1.8) regulators. When regulators are disabled: • External 1.8V must be supplied to VDDA1.8 and VDD1.8 pins. When the regulators are disabled, VDDA1.8 may be connected to VDD1.8 and a bypass capacitor (0.1uF recommended) should be connected to each pin. • The voltage at VDD3.3 must be at least 2.64V (0.8 * 3.3V) before voltage is applied to VDDA1.8 and VDD1.8.
32	RBIAS	External 12KΩ +/- 1% bias resistor to ground.

USB3300 Symbol, Footprint, and CAD Model

Features of the USB3300

Certification and Compliance

The USB3300 transceiver stands out with its USB-IF certification, highlighting its conformity to Hi-Speed under USB 2.0 standards. Its alignment with the ULPI Specification 1.1 in 8-bit mode reinforces its technical solidity, facilitating broad interoperability across various USB systems.

Energy Efficiency Considerations

A distinctive feature is its low operational currents, which enhance energy management in both bus-powered and battery-dependent devices. This makes it compatible with applications necessitating minimal power usage while delivering necessary performance.

Protection and Connectivity

The transceiver extends remarkable electrostatic discharge (ESD) protection, a factor in safeguarding against potential damage. The inclusion of integrated characteristics supporting On-the-Go (OTG) applications broadens its applicability. It allows for fluid connection between multiple devices independently of a host computer, reflecting the evolving trends in device connectivity.

Adaptability and Versatility

Designed to function reliably within an industrial temperature spectrum, the USB3300 stands as a dependable option for environments subject to varying and at times severe conditions. Its compact 5x5mm QFN package boosts its adaptability, enabling seamless integration into space-restrictive designs without sacrificing functionality. This fosters efficient design configurations and potentially sparks innovations in product dimensions and shape.

USB3300 Technical Specifications

Technical specifications, characteristics, parameters, and similar components to the Microchip Technology USB3300-EZK.

Type	Parameter
Factory Lead Time	11 Weeks
Mount	Surface Mount
Number of Pins	32
Usage Level	Industrial grade
Packaging	Tray
JESD-609 Code	e3
Part Status	Active
Number of Terminations	32
Terminal Position	QUAD
Supply Voltage	3.3V
Base Part Number	USB3300
Voltage	5V
Operating Supply Current	54.7mA
Data Rate	480 Mbps
Contact Plating	Tin
Package / Case	32-VQFN Exposed Pad
Weight	188.609377mg
Operating Temperature	-40°C~85°C
Published	2005
Pbfree Code	yes
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Voltage - Supply	3V~3.6V
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Function	Controller
Interface	ULPI
Number of Ports	1
Protocol	USB
Telecom IC Type	INTERFACE CIRCUIT
USB	USB 2.0
Ambient Temperature Range High	85°C
Length	5mm
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant
ESD Protection	Yes
Standards	USB 2.0, OTG
Height	1mm
Width	5mm
Radiation Hardening	No
Lead Free	Lead Free

Alternatives of the USB3300

Part Number	Manufacturer	Package / Case	Number of Pins	Interface	Number of Ports	Data Rate	Supply Voltage	RoHS Status	Mount
USB3300-EZK	Microchip Technology	32-VFQFN Exposed Pad	32	ULPI	1	480 Mbps	3.3 V	ROHS3 Compliant	Surface Mount
78Q2123/F	Maxim Integrated	24-VFQFN Exposed Pad	24	UART, USB	1	480 Mbps	1.8 V	ROHS3 Compliant	Surface Mount
USB3343-CP	Microchip Technology	28-VFQFN Exposed Pad	28	-	2	480 Mbps	3.3 V	ROHS3 Compliant	Surface Mount
USB2412-DZK	Microchip Technology	32-VFQFN Exposed Pad	32	-	-	100 Mbps	3.3 V	ROHS3 Compliant	Surface Mount
USB2422-I/MJ	Microchip Technology	24-VFQFN Exposed Pad	24	-	-	480 Mbps	3.3 V	ROHS3 Compliant	Surface Mount

Functional Block Diagram of the USB3300

Application Diagrams of the USB3300

Applications of the USB3300

Expanding Device Integration

The USB3300 is at the heart of countless devices, deftly bridging consumer electronics with industrial applications. When integrated into mobile phones and PDAs, its contribution transcends mere connectivity. It boosts data transfer efficiency, enabling seamless synchronization with a multitude of digital platforms. In a rapidly evolving world that feeds on real-time data exchange, this efficiency allows to interact more fluidly with their devices.

Advancing Media Solutions

Within media players, the USB3300 enabling swift transfer and playback of high-fidelity media files. As media content becomes increasingly intricate and voluminous, robust data solutions become important . Implementing such components underlines an industry shift towards minimizing latency.

Industrial Optimization

For industrial purposes, incorporating the USB3300 into scanners signifies a step towards streamlined operational workflows. Its ability to process large data volumes efficiently and reliably thrives in environments demanding accuracy.

Balancing Performance and Practicality

The balance of performance and practicality is vividly illustrated by the USB3300's extensive versatility across diverse domains. It mirrors a broader movement toward crafting technology that excels in performance while being seamlessly integrable into existing systems. This adaptability is appreciated by many who seek to upgrade or expand their technological infrastructure with ease.

Package for USB3300

USB3300 Manufacturer Information

Located in Arizona, Microchip Technology excels in creating intelligent embedded control solutions. From its early days, the company has played a transformative role, enhancing design efficiency and aiding various sectors in speeding up their time-to-market. Recognized for its innovation, the USB3300 is a prominent element in Microchip's diverse portfolio, reflecting a commitment to technical achievement. The USB3300 signifies a remarkable progression in embedded system design, catering to numerous applications, performance and efficiency. Advances in technology have honed its practical application, integrating effectively into complex designs that require quick data transfer and stable connections. Though some argue that reliance on such components might complicate system integration, the notable advantages far outweigh these concerns. Microchip Technology's trajectory showcases an astute grasp of market needs and the vision to anticipate tech trends, positioning the company as a harbinger of future innovations.

Datasheet PDF

USB3300-EZK Datasheets:

USB3300.pdf

Label and Packing Changes 23/Sep/2015.pdf

MBB/Label Chgs 16/Nov/2018.pdf

SCC Site Qualification 20/Apr/2015.pdf

USB3300 14/Jun/2016.pdf

78Q2123/F Datasheets:

78Q2123/33.pdf

Maxim Integrated RoHS Cert.pdf

Material Declaration 78Q2123/F.pdf

USB3343-CP Datasheets:

USB334x DataSheet.pdf

Label and Packing Changes 23/Sep/2015.pdf

MBB/Label Chgs 16/Nov/2018.pdf

2.73KHz.pdf

USB334x 27/Feb/2018.pdf

USB334x Brief.pdf

USB2412-DZK Datasheets:

USB2412 Errata~.pdf

USB2412 Brief.pdf

USB2412 Datasheet.pdf

USB2422-I/MJ Datasheets:

Cylindrical Battery Holders.pdf

Label and Packing Changes 23/Sep/2015.pdf

MBB/Label Chgs 16/Nov/2018.pdf

SCC Site Qualification 20/Apr/2015.pdf