USB3300-EZK - Microchip Technology

Manufacturer Part Number

USB3300-EZK

Manufacturer

Microchip Technology

Introduction

The USB3300-EZK is a high-performance USB 2.0 physical layer (PHY) chip, providing interface solutions with ULPI interface for USB applications.

Product Features and Performance

Supports USB 2.0 OTG protocol

Operates with a 3V to 3.6V power supply

Interfaces via ULPI, enabling easier integration with a variety of USB controllers

Designed for operational efficiency under temperatures ranging from -40°C to 85°C

Housed in a compact 32-VFQFN exposed pad package for efficient PCB space usage

Product Advantages

Optimized for low power consumption

Enhanced durability for operation in extreme environments

Streamlines product design with simplified integration for USB functionalities

Key Technical Parameters

Voltage supply range: 3V ~ 3.6V

Operating temperature range: -40°C ~ 85°C

ULPI Interface for flexible connection to USB controllers

Compliance with USB 2.0 and OTG standards for wide-ranging compatibility

Package: 32-VFQFN Exposed Pad

Quality and Safety Features

Designed in accordance with industry standards for USB 2.0 compatibility

Subjected to rigorous testing for operational reliability across varied environmental conditions

Compatibility

Compatible with USB 2.0 and OTG standards

Supports seamless integration with MCUs and processors via ULPI interface

Application Areas

Designed for a wide range of USB-enabled devices including smartphones, tablets, and personal computers

Suitable for industrial, automotive, and consumer electronics applications requiring USB connectivity

Product Lifecycle

The product status is Active, indicating ongoing manufacturing and availability

No immediate discontinuation notices, ensuring long-term availability and support

Several Key Reasons to Choose This Product

Provides a high-performance USB 2.0 PHY solution facilitating faster data transfer speeds

Supports a wide operating temperature range ensuring reliability in harsh conditions

Ease of integration with various microprocessors and microcontrollers via ULPI enhances product design flexibility

Low power consumption design contributes to overall energy efficiency of end devices

Compatibility with USB 2.0 and OTG standards ensures broad application suitability and future-proofing