on November 20th 27

TPS1H100BQPWPRQ1 High-Side Power Switch: Datasheet, Layout, and Pinout

This article delves into the technological intricacies and applications of the TPS1H100BQPWPRQ1, a high-side power switch developed by Texas Instruments. Noted for integrating an NMOS power FET with a charge pump, this device enhances power management efficiency for reliable performance in automotive and industrial applications. We will explore the switch’s design, pin configurations, and technical specifications to provide a deep understanding of its functional excellence and application versatility.

Catalog

What is the TPS1H100BQPWPRQ1?

The TPS1H100BQPWPRQ1 is crafted to excel in power management applications, merging an NMOS power FET with a robust charge pump. Its performance is remarkable in single-channel operations, where superior protection features facilitate effective load management. The inclusion of advanced diagnostic and current-sense functionalities greatly enhances the reliability of the system. The device boasts an adaptable current-limit function, which contributes to its durability across a variety of demanding applications.

This device exemplifies remarkable versatility by enabling microcontroller interface multiplexing. It achieves this by switching diagnostics to a high-impedance mode when diagnostics are not in play. This kind of flexibility supports a more efficient and streamlined circuit design in practice. The TPS1H100BQPWPRQ1 is engineered to meet the diverse demands commonly encountered in different applications.

The variance between versions A and B reflects a considerate design that accommodates diverse user needs. Version A’s open-drain status reporting requires a pull-up to the microcontroller's supply, while version B enhances monitoring with current sensing capabilities. The K value remains constant and is resilient to environmental changes in the electronics field a reliable benchmark for predicting product performance across different conditions.

TPS1H100BQPWPRQ1 Pin Configuration

Pin Number	Pin Name	Description
1	NC	No connection; should be left unconnected
2	GND	Ground pin
3	IN	Input pin; used to control the device
4	NC	No connection; should be left unconnected
5, 6, 7	OUT	Output pins connected to the load (NMOS source)
8, 9, 10	VS	Supply voltage input from the battery
11	NC	No connection; should be left unconnected
12	DIAG_EN	Diagnostic enable pin; connects to MCU for enabling/disabling diagnostics
13	CL	Current limit setting pin; configurable with an external resistor
14	CS	Current sense output pin; provides feedback for load current

TPS1H100BQPWPRQ1 Symbol, Footprint, and CAD Model

Features of the TPS1H100BQPWPRQ1

• Meets AEC-Q100 standards for dependability in harsh automotive environments.

• Supports functional safety, prioritizing reliability in automotive systems.

• Operates from 3.5V to 40V, covering diverse application needs.

• Reduces standby power to <0.5 µA, extending battery life and promoting energy efficiency.

• Functions reliably in extreme temperatures (-40°C to 150°C).

• Designed to handle intense heat and cold typical of engine compartments.

• Includes overload, short-circuit, and thermal shutdown protections to prevent damage during faults.

• Thermal shutdown shields the device in short-circuit scenarios.

• Provides accurate current monitoring.

• Adjustable current limits ensure flexibility across varied automotive circuits.

• Incorporates UVLO (Under Voltage Lock Out) and reverse battery protection to handle voltage inconsistencies.

• Ensures system stability in unpredictable automotive electrical environments.

• Features enhanced fault detection for output state supervision and thermal anomaly identification.

• Streamlined maintenance through actionable diagnostic insights.

• Housed in a 14-Pin Thermally-Enhanced PWP Package for effective heat dissipation.

• Maintains efficiency and reliability under high usage conditions.

TPS1H100BQPWPRQ1 Technical Specifications

Type	Parameter
Lifecycle Status	ACTIVE (Last Updated: 6 days ago)
Mounting Type	Surface Mount
Surface Mount	YES
Operating Temperature	-40°C~125°C TA
Series	Automotive, AEC-Q100
Pbfree Code	yes
Moisture Sensitivity Level (MSL)	3 (168 Hours)
ECCN Code	EAR99
Terminal Position	DUAL
Peak Reflow Temperature (Cel)	260
Supply Voltage	13.5V
Base Part Number	TPS1H100
Factory Lead Time	8 Weeks
Package / Case	14-PowerTSSOP (0.173, 4.40mm Width)
Number of Pins	14
Packaging	Tape & Reel (TR)
JESD-609 Code	e4
Part Status	Active
Number of Terminations	14
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING
Number of Functions	1
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of Outputs	1
Output Type	N-Channel
Supply Voltage-Max (Vsup)	40V
Interface	On/Off
Voltage - Supply (Vcc/Vdd)	Not Required
Switch Type	General Purpose
Voltage - Load	5V~40V
Turn On Time	50 μs
Rds On (Typ)	80m Ω
Turn Off Time	50 μs
Ambient Temperature Range High	125°C
Features	Status Flag
Length	5mm
Thickness	1mm
Lead Free	Lead Free
Max Output Current	4A
Supply Voltage-Min (Vsup)	5V
Output Configuration	High Side
Input Type	Non-Inverting
Ratio - Input	1:01
Fault Protection	Current Limiting (Adjustable), Open Load Detect, Over Temperature, UVLO
Output Peak Current Limit-Nom	7A
Max Junction Temperature (Tj)	150°C
Built-in Protections	TRANSIENT: OVER CURRENT; THERMAL; UNDER VOLTAGE
Output Current Flow Direction	SINK
Height	1.2mm
Width	4.4mm
RoHS Status	ROHS3 Compliant

Functional Block Diagram of TPS1H100BQPWPRQ1

Application Diagram for TPS1H100BQPWPRQ1

Layout of the TPS1H100BQPWPRQ1

To prevent overheating, the device's temperature (TJ) must stay below 150°C, as high output currents can cause heat buildup. While the HTSSOP package handles heat well, effective PCB design for proper heat dissipation and device longevity. To improve heat transfer, maximize copper coverage on the PCB since copper efficiently carries heat away, especially when no additional heat sinks are present. Place as many thermal vias as possible under the package's ground pad to enhance thermal conductivity, and ensure all vias are fully plated or filled to avoid solder gaps. At least 85% of the ground pad should have solder coverage to maintain reliable performance.

Without a GND Network

If there’s no GND network on the PCB, connect the thermal pad directly to the board’s GND copper to improve heat dissipation. The picture below shows the pin configuration and layout of an electronic device, highlighting connections for ground, input, output, and various control functions, but without a ground network illustrated.

Layout Without a GND Network

With a GND Network

If a GND network is present, connect the thermal pad to the board’s GND copper using one trace through the GND network. The picture below shows the pin configuration and layout of an electronic device, featuring a detailed ground network and connections for power, inputs, outputs, and various control signals.

Layout With a GND Network

Applications of TPS1H100BQPWPRQ1

High-side Power Switching for Automotive Modules

High-side switching plays a role in automotive systems, facilitating the delivery of power to modules, including lighting systems, control units, and entertainment components. The TPS1H100BQPWPRQ1 excels in managing this power switching, which not only boosts efficiency but also enhances safety by reducing the likelihood of short circuits. As vehicles evolve with advanced electronic features, the necessity for robust, efficient, and compact power management solutions is increasingly apparent.

Low-Power Lighting Control

In the quest for energy-efficient designs, the management of low-power lighting emerges as a pressing concern. The TPS1H100BQPWPRQ1 adeptly regulates LED lighting systems, offering dimming and on/off functionalities that contribute to energy savings. This application finds relevance in smart buildings, where lighting can be dynamically adjusted based on occupancy levels or ambient lighting conditions.

High-Side Drivers for Relays and Solenoids

The functionality of high-side drivers, as enabled by the TPS1H100BQPWPRQ1, is integral to the activation of relays and solenoids prevalent in numerous electromechanical systems. This role is need for the control of actuators within industrial automation frameworks. The application of high-side drivers not only amplifies system performance but also fosters enhanced precision and reliability.

Digital Output Management in PLCs

Programmable Logic Controllers (PLCs) heavily depend on adaptable digital output management to govern diverse processes seamlessly. The TPS1H100BQPWPRQ1 facilitates streamlined output management within PLCs, enabling effective communication between the PLC system and its connected devices. As industries lean towards greater automation, incorporating such efficient integrated circuits into their operations not only elevates productivity but also refines workflow optimization. Thus, the integration of advanced ICs for digital management has been associated with heightened operational effectiveness across multiple sectors.

Adaptability for Various Load Types

The adaptability of the TPS1H100BQPWPRQ1 encompasses its capacity to manage a multitude of load types, resistive, inductive, and capacitive. This characteristic allows to implement the IC across a range of applications without necessitating extensive redesigns.

Package Dimensions for TPS1H100BQPWPRQ1

TPS1H100BQPWPRQ1 Manufacturer Information

Texas Instruments emerges as a prominent figure in semiconductor manufacturing, skillfully producing a wide range of components like the TPS1H100BQPWPRQ1 to cater to the insatiable global appetite for electronic devices. Their reputation is strongly tied to their advanced expertise in analog and embedded technologies, which propels an environment rich in continuous innovation. The dynamic nature of their offerings symbolizes a deep commitment to enhancing electronic design and functionality, as they navigate the complexities of the tech landscape. Their product development strategies are intricately linked to global digital transformation initiatives, enabling them to hold a competitive position. Texas Instruments’ prominent status in semiconductor manufacturing is fortified by their persistent emphasis on innovation, the application of state-of-the-art technologies, and a keen alignment with universal industry trends.

Datasheet PDF

TPS1H100BQPWPRQ1 Datasheets:

Design 22/Feb/2022.pdf

TPS1H100-Q1 19/Jun/2018.pdf

Symbolization Update 14/Feb/2023.pdf

TPS1H100-Q1.pdf

TPS1H100 31/Mar/2017.pdf