The LSM9DS1TR represents a cutting-edge sensor module encompassing a 3D accelerometer, 3D gyroscope, and 3D magnetometer. These integrated sensors facilitate detailed motion and orientation analysis, providing a unique fusion of functionalities that cater to a plethora of applications. With connectivity options through I2C, operating up to 400 kHz or SPI interfaces, it can seamlessly adapt to various communication protocols, simplifying integration into diverse technological ecosystems. Designed to function efficiently within a temperature spectrum from -40°C to +85°C, the device continues to perform consistently under harsh environmental conditions, gaining trust in industries where dependable performance is esteemed. The incorporation of these three sensors opens doors to multiple fields, including electronics, robotics, and wearable technology. In electronics, precise motion tracking can elevate gaming or virtual reality experiences, offering smoother and more intuitive interactions that captivate senses. Robotics benefits from accurate orientation and motion detection, which are central to successful navigation and environmental interaction. Wearable technology gains an advantage from the compactness of LGA packaging, nurturing the creation of lightweight and discreet devices.
The LSM9DS1TR sensor stands out with its varied detection channels, opening doors to numerous application scenarios. It supports adjustable full scales for acceleration ranging from ±2 to ±16 g, magnetic fields from ±4 to ±16 gauss, and angular rates from ±245 to ±2000 dps, showcasing a broad spectrum of flexibility. The 16-bit high-resolution output delivers precision, aligning with the diverse needs of electronics and industrial sectors. This versatility often fulfills the desire for adaptability in dynamic environments.
With support for both I2C and SPI interfaces, this sensor adapts to a range of communication protocols, meeting varied integration demands. It functions on an analog supply voltage between 1.9V and 3.6V, accommodating different settings and power conditions seamlessly. Power-saving modes boost its efficiency, which proves advantageous in battery-powered devices. Emphasizing energy efficiency resonates with efforts to extend device lifespan and cut down operational costs, a relief for stakeholders concerned with sustainability.
The sensor's functionalities include programmable interrupts and an embedded temperature sensor, enhancing system interaction and environmental monitoring. Features like FIFO and motion detection support complex data processing and time analysis, offering insights into dynamic movements. These functionalities can spark a sense of accomplishment for cutting-edge solutions.
Adhering to ECOPACK® standards, the LSM9DS1TR aligns with environmentally mindful manufacturing practices. This not only meets regulatory benchmarks but also caters to the rising demand for sustainable technologies. Embracing environmentally responsible components can represent a dedication to corporate social responsibility.
Part Number |
Manufacturer |
Package / Case |
Number of Pins |
Min Supply Voltage |
Supply Voltage |
Max Supply Voltage |
Operating Temperature |
Output Type |
Mounting Type |
ICM-30630 |
TDK InvenSense |
24-TFLGA Module |
24 |
2.4 V |
3 V |
3.6 V |
-40°C ~ 85°C (TA) |
I2C, SPI |
Surface Mount |
LSM330TR |
STMicroelectronics |
24-TFQFN Module Exposed Pad |
24 |
- |
- |
- |
-40°C ~ 85°C (TA) |
I2C, SPI |
Surface Mount |
Type |
Parameter |
Lifecycle Status |
ACTIVE (Last Updated: 7 months ago) |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C TA |
Part Status |
Active |
Number of Terminations |
24 |
HTS Code |
8542.39.00.01 |
Terminal Form |
BUTT |
Number of Functions |
1 |
Terminal Pitch |
0.43mm |
Base Part Number |
LSM9D |
Max Supply Voltage |
3.6V |
Analog IC - Other Type |
ANALOG CIRCUIT |
Length |
3.5mm |
Factory Lead Time |
16 Weeks |
Package / Case |
24-TFLGA Module |
Number of Pins |
24 |
Packaging |
Cut Tape (CT) |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
ECCN Code |
EAR99 |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
2.2V |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Output Type |
I2C, SPI |
Min Supply Voltage |
1.9V |
Sensor Type |
Accelerometer, Gyroscope, Magnetometer, Temperature, 9
Axis |
Height Seated (Max) |
1.027mm |
Width |
3mm |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. (1) |
Max. |
Unit |
Vdd |
Supply voltage |
1.9 |
3.6 |
V |
||
Vdd_IO |
Module power supply for I/O |
1.71 |
Vdd+0.1 |
V |
||
Idd_XM |
Current consumption of the accelerometer and magnetic
sensor in normal mode (2) |
600 |
µA |
|||
Idd_G |
Gyroscope current consumption in normal mode (3) |
4 |
mA |
|||
Top |
Operating temperature range |
-40 |
85 |
°C |
||
Trise |
Time for power supply rising (4) |
0.01 |
100 |
ms |
||
Twait |
The time delay between Vdd_IO and Vdd (4) |
0 |
10 |
ms |
Symbol |
Ratings |
Maximum Value |
Unit |
Vdd |
Supply voltage |
-0.3 to 4.8 |
V |
Vdd_IO |
I/O pins supply voltage |
-0.3 to 4.8 |
V |
Vin |
Input voltage on any control pin (including CS_A/G, CS_M,
SCL/SPC, SDA/SDI/SDO, SDO_A/G, SDO_M) |
0.3 to Vdd_IO +0.3 |
V |
AUNP |
Acceleration (any axis) |
3,000 for 0.5 ms |
g |
10,000 for 0.1 ms |
g |
||
MEF |
Maximum exposed field |
1,000 |
gauss |
ESD |
Electrostatic discharge protection (HBM) |
2 |
kV |
TSTG |
Storage temperature range |
-40 to +125 |
°C |
The power supply timing for this device involves a few steps to ensure reliable operation. First, the rise time (called "Triose") is the period it takes for the power supply voltage (Vdd_IO) to increase from 10% to 90% of its final value. This rise time needs to be carefully controlled so that the device’s I/O lines can stabilize before the main operating voltage (Vdd) starts to increase. Once Vdd_IO has reached 90% of its target value, there’s a required delay time called "Twait." This delay allows the I/O and interface logic to settle under a steady supply voltage before Vdd begins to ramp up. The Twait period is important for avoiding configuration errors or potential damage, as it prevents the core logic and memory from being powered up too soon.
After Twait, the core voltage Vdd can begin ramping up smoothly until it reaches its operating level. This ramp-up must be gradual to prevent any voltage spikes that might disrupt the device’s internal circuits. Finally, once both Vdd_IO and Vdd have reached stable levels, the device initialization can begin. This step involves setting up internal registers, calibrating sensors, and configuring communication protocols as needed. Following these steps helps ensure that the device operates reliably within its specified electrical and operational limits. For specific details or values for Triose and Twait, refer to the datasheet or reference manual provided by the manufacturer.
The LSM9DS1 sensor module, which includes both an accelerometer and a gyroscope, can operate in different modes based on application needs. In Accelerometer Only Mode, only the accelerometer is active while the gyroscope stays off, making it useful for measuring linear acceleration while conserving power. In Combined Mode, both the accelerometer and gyroscope are active and run at the same Output Data Rate (ODR), which is ideal for applications that need comprehensive motion tracking, such as drones, wearable devices, or other smart devices that rely on accurate orientation, position, and movement data.
Recent developments in indoor navigation systems have led to notable progress, offering precise location tracking and seamless integration with smart environments. This technology is reshaping how people navigate through spaces while refining the accuracy of smart home interfaces. The detailed process of mapping indoor environments facilitates a smoother interaction, particularly advantageous in intricate spaces like large shopping malls, airports, and healthcare facilities. Here, precise navigation enhances satisfaction and boosts operational efficiency. These environments can be quite overwhelming and emotionally engaging, making such enhancements even more valuable.
Smart interface control technology provides versatility and accessibility through sophisticated gestures and voice commands. Its practicality in everyday life is evident across various applications, including lighting systems, climate control, and security management. Advances in this area feature adaptive learning algorithms that tailor responses to preferences, adding a layer of personalization and efficiency in controlling smart devices. An illustrative example is the use of adaptive interfaces in smart thermostats, which adjust based on learned routines, thus maintaining a balance between convenience and energy conservation.
Gesture recognition technology has steadily improved, resulting in more precise and responsive interactions. This advancement supports a smooth applications that range from augmented reality (AR) devices to virtual assistants. In gaming, gesture recognition has transformed player interaction with virtual environments. The development of multi-modal systems, which combine gesture recognition with voice and facial recognition, represents ongoing progress toward more organic and seamless machine interactions.
The gaming industry leads in adopting technology that facilitates dynamic interaction, substantially enriching gameplay experiences. The inclusion of motion-sensing technology has initiated groundbreaking shifts, enabling a more engaging and physical gaming experience. As technology progresses, the potential grows for more intricate and interactive gaming experiences blending real and virtual elements. This trend is evident in the increasing use of VR and AR in gaming, offering players not just entertainment but also a canvas for creativity and innovation.
The LSM9DS1TR, a marvel of microelectronics crafted by STMicroelectronics, embodies the seamless integration of cutting-edge System-on-Chip technology into varied applications. This module combines accelerometer, gyroscope, and magnetometer functions, broadening motion-sensing possibilities for everything from everyday gadgets to complex industrial systems. STMicroelectronics excels in crafting efficient and high-performance solutions, continually advancing the field through relentless research and development endeavors. The company's global influence is marked by a dedication to sustainability and high standards, delivering circuits and sensors that adapt to dynamic shifts in market needs.
Cylindrical Battery Holders.pdf
Cylindrical Battery Holders.pdf
Cylindrical Battery Holders.pdf
Cylindrical Battery Holders.pdf
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The LSM9DS1TR functions reliably between -40°C and 85°C TA, proving its suitability across varied environmental conditions. Its versatility supports its use in both industrial sectors and electronics. In demanding settings, such as outdoor winter tasks, sustaining operational effectiveness remains a focal point. Manufacturers engage in extensive testing to ascertain that components retain their resilience and efficiency under challenging circumstances.
Operating efficiently at a nominal supply voltage of 2.2V, the LSM9DS1TR accommodates low-power applications, thereby fostering energy efficiency. Others prioritize components with these voltage characteristics to promote extended battery life and reduced energy consumption, especially in portable devices. By fine-tuning power usage, such devices enjoy prolonged operational times, aligning with the modern emphasis on energy conservation.
With a configuration of 24 pins, this sensor module enables diverse interfacing opportunities and flexible connectivity. This pin layout ensures easy incorporation with microcontrollers, a consideration for developing multifaceted electronic systems. Others stress the importance of managing pin efficiency to enhance functionality and reduce the physical footprint of circuits, promoting elegant product designs.
Available in Cut Tape (CT) packaging, the LSM9DS1TR is often preferred for its ease of handling in manufacturing environments. This packaging type streamlines automated assembly processes, minimizing the need for manual adjustments and errors, thus boosting production efficacy. In sophisticated manufacturing, automated setups utilize such packaging to ensure rapid processing and consistent quality in large-scale outputs.
Capable of tolerating a maximum supply voltage of 3.6V, the sensor provides ample flexibility to manage voltage variations typical in different power conditions. Its capability to handle diverse power inputs makes it ideal for devices experiencing variable power sources. Commonly design for voltage tolerance as a protective measure to shield components from transient overvoltage risks, thereby enhancing the device's durability and dependability in usage scenarios.
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