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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU4EG-2FBVB900E
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XCZU4EG-2FBVB900E - AMD

Manufacturer Part Number
XCZU4EG-2FBVB900E
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU4EG-2FBVB900E
ECAD Model
Parts Description
IC SOC CORTEX-A53 900FCBGA
Package
900-BBGA, FCBGA
Data sheet
XCZU4EG-2FBVB900E.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 17

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Specifications

XCZU4EG-2FBVB900E Tech Specifications
AMD - XCZU4EG-2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU4EG-2FBVB900E

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 900-FCBGA (31x31)  
Speed 533MHz, 600MHz, 1.3GHz  
Series Zynq® UltraScale+™ MPSoC EG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 900-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature 0°C ~ 100°C (TJ)  
Number of I/O 204  
Flash Size -  
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU4  
Architecture MCU, FPGA  

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XCZU4EG-2FBVB900E

Manufacturer

AMD Xilinx

Introduction

This product is an Integrated Circuit (IC) that falls under the Embedded - System On Chip (SoC) small classification.

Product Features and Performance

ROHS3 Compliant

900-FCBGA (31x31) Manufacturer's packaging

Base Product Number: XCZU4

Architecture: MCU, FPGA

Package / Case: 900-BBGA, FCBGA

Operating Temperature: 0°C ~ 100°C (TJ)

Series: Zynq UltraScale+ MPSoC EG

Supplier Device Package: 900-FCBGA (31x31)

Package: Tray

Number of I/O: 204

Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2

Peripherals: DMA, WDT

Speed: 533MHz, 600MHz, 1.3GHz

RAM Size: 256KB

Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells

Product Advantages

Powerful processing capabilities with Quad ARM Cortex-A53 and Dual ARM Cortex-R5 cores

Flexible and configurable FPGA fabric with 192K+ Logic Cells

Wide range of connectivity options

Suitable for a variety of embedded and industrial applications

Key Technical Parameters

ROHS3 Compliant

900-FCBGA (31x31) package

Operating temperature range: 0°C to 100°C

Quad ARM Cortex-A53 and Dual ARM Cortex-R5 cores

192K+ Logic Cells FPGA fabric

256KB RAM

Quality and Safety Features

ROHS3 Compliant

Tested and qualified for industrial and embedded applications

Compatibility

This product is compatible with a wide range of embedded systems, industrial automation, and other applications that require a powerful and flexible System-on-Chip solution.

Application Areas

Embedded systems

Industrial automation

Robotics

Medical devices

Telecommunications

Aerospace and defense

Product Lifecycle

This product is currently in active production and is not nearing discontinuation. Replacement or upgrade options may be available in the future as part of the Zynq UltraScale+ MPSoC product family.

Key Reasons to Choose This Product

Powerful and flexible processing capabilities with Quad ARM Cortex-A53 and Dual ARM Cortex-R5 cores.

Configurable FPGA fabric with 192K+ Logic Cells, allowing for custom hardware acceleration.

Wide range of connectivity options, enabling integration with various peripherals and systems.

Suitable for a wide range of embedded and industrial applications, providing a versatile solution.

ROHS3 compliance and industrial-grade quality, ensuring reliability and safety.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU4EG-2FBVB900E

Product Attribute XCZU4EG-2FBVB900E XCZU4CG-2FBVB900E XCZU4CG-2SFVC784E XCZU4EV-1FBVB900E
Part Number XCZU4EG-2FBVB900E XCZU4CG-2FBVB900E XCZU4CG-2SFVC784E XCZU4EV-1FBVB900E
Manufacturer AMD AMD AMD AMD
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 784-BFBGA, FCBGA 900-BBGA, FCBGA
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Number of I/O 204 204 252 204
Flash Size - - - -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB 256KB 256KB 256KB
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC EV
Speed 533MHz, 600MHz, 1.3GHz 533MHz, 1.3GHz 533MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Base Product Number XCZU4 XCZU4 XCZU4 XCZU4
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 784-FCBGA (23x23) 900-FCBGA (31x31)
Package Tray Tray Tray Tray

XCZU4EG-2FBVB900E Datasheet PDF

Download XCZU4EG-2FBVB900E pdf datasheets and AMD documentation for XCZU4EG-2FBVB900E - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU4EG-2FBVB900E

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32D-XCZU4EG-2FBVB900E

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