Manufacturer Part Number
XCZU4EG-2SFVC784E
Manufacturer
Xilinx
Introduction
High-performance SoC for embedded applications incorporating an FPGA and MCU.
Product Features and Performance
Integrated MCU and FPGA architecture
Multi-core processing with ARM® Cortex™ processors
Programmable Logic Cells for flexible hardware customization
Rich set of peripherals for versatile connectivity
Advanced power management for efficient operation
High-speed transceivers and memory interfaces
Product Advantages
Scalability from high-throughput to low-power applications
Reduction of system complexity with integrated components
Enhanced security features for data protection
Superior signal processing capability
Key Technical Parameters
Architecture: MCU, FPGA
No Flash Size
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed Grades: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq® UltraScale+™ FPGA, 192K+ Logic Cells
Operating Temperature Range: 0°C ~ 100°C
I/O Count: 252
Quality and Safety Features
Reliable system operation within industrial temperature ranges
Built-in safety mechanisms like WDT (Watchdog Timer)
Stringent product qualification standards followed by Xilinx
Compatibility
Standards compliance for easy system integration
Support for multiple high-speed interfaces
Compatible with a wide range of software tools and development environments
Application Areas
Data Centers
AI and Machine Learning
Embedded Vision
Industrial Automation
Automotive systems
Aerospace and Defense applications
Product Lifecycle
Currently Active status
Not nearing discontinuation
Future replacements or upgrades available in Zynq UltraScale+ series
Several Key Reasons to Choose This Product
Combined MCU and FPGA solution optimizes both processing power and flexibility
Breadth of integrated peripherals minimizes additional component needs
Scalable solutions from Xilinx support varying performance and power requirements
Strong community and vendor support for development and troubleshooting
Capable of supporting next-generation applications with high-speed connectivity options
Robust industrial operating temperature range ensures reliability in harsh environments
