Manufacturer Part Number
XCZU4EV-1FBVB900E
Manufacturer
xilinx
Introduction
The XCZU4EV-1FBVB900E is part of the Zynq® UltraScale+™ MPSoC EV product series, designed to provide a comprehensive embedded system on chip (SoC) solution integrating MCU and FPGA architecture for diverse applications.
Product Features and Performance
Integrates MCU and FPGA for versatile programming and application.
Features 192K+ logic cells for extensive processing capabilities.
Supports a range of connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
Offers peripherals like DMA and WDT to enhance performance.
Provides functionality at varying speeds of 500MHz, 600MHz, and 1.2GHz for flexible system design.
Product Advantages
Combines the processing power of an MCU with the flexibility of an FPGA.
High-speed interfaces and a wide range of I/O options for extensive peripheral connectivity.
Supports high-level integration for complex applications with reduced system power.
Key Technical Parameters
Architecture: MCU, FPGA
RAM Size: 256KB
Number of I/O: 204
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
Quality and Safety Features
Operates reliably within a broad temperature range.
Comes in a robust 900-FCBGA package ensuring secure mounting and longevity.
Compatibility
Offers multi-protocol connectivity for seamless system integration.
Compatible with a variety of development tools and software platforms provided by Xilinx.
Application Areas
Ideal for embedded vision, Industrial IoT, automotive applications, and multi-media processing.
Suitable for advanced computational tasks in scientific and medical devices.
Product Lifecycle
Status: Active
Continuous manufacturer support with no immediate plan for discontinuation.
Upgrade paths available for future expansion or performance enhancements.
Several Key Reasons to Choose This Product
State-of-the-art integration of MCU and FPGA technology for unrivaled flexibility and performance.
Comprehensive connectivity options to meet complex application requirements.
Superior logic cell density for handling advanced computational tasks.
Robust temperature and package design for reliability in demanding environments.
Active product support and clear upgrade paths for future scalability and sustainability.
