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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU4EG-1FBVB900E
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XCZU4EG-1FBVB900E - AMD

Manufacturer Part Number
XCZU4EG-1FBVB900E
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU4EG-1FBVB900E
ECAD Model
Parts Description
IC SOC CORTEX-A53 900FCBGA
Package
900-BBGA, FCBGA
Data sheet
XCZU4EG-1FBVB900E.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 21

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Specifications

XCZU4EG-1FBVB900E Tech Specifications
AMD - XCZU4EG-1FBVB900E technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU4EG-1FBVB900E

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 900-FCBGA (31x31)  
Speed 500MHz, 600MHz, 1.2GHz  
Series Zynq® UltraScale+™ MPSoC EG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 900-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature 0°C ~ 100°C (TJ)  
Number of I/O 204  
Flash Size -  
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU4  
Architecture MCU, FPGA  

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001

Parts Introduction

Manufacturer Part Number

XCZU4EG-1FBVB900E

Manufacturer

Xilinx

Introduction

The XCZU4EG-1FBVB900E is a highly integrated Embedded System On Chip (SoC) from Xilinx's Zynq® UltraScale+™ MPSoC EG series, offering a combination of a high-performance ARM-based processor and FPGA capabilities in a single device.

Product Features and Performance

Integrates MCU and FPGA architecture

Dual-core ARM Cortex-A53 and ARM Cortex-R5 processors

FPGA with 192K+ Logic Cells for flexible hardware acceleration

256KB RAM for efficient data handling

Multiple connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG

High-speed operation with processors up to 1.2GHz and FPGA

Packaged in a 900-BBGA, FCBGA for high-density board designs

Product Advantages

Combination of high-performance processors and FPGA for versatility in applications

Wide range of connectivity for easier integration into various systems

Supports complex data processing and hardware acceleration

Suitable for demanding applications because of high operating temperatures (0°C ~ 100°C)

Key Technical Parameters

RAM Size: 256KB

Speed: 500MHz, 600MHz, 1.2GHz

Primary Attributes: Zynq® UltraScale+™ FPGA, 192K+ Logic Cells

Operating Temperature: 0°C ~ 100°C (TJ)

Number of I/O: 204

Quality and Safety Features

Manufactured by Xilinx, a leader in integrated circuit design

Designed for high reliability and operation in challenging environments

Compatibility

Supports a wide range of standard communication protocols

Compatible with various development tools and software environments from Xilinx

Application Areas

Industrial automation and control systems

Automotive driver assistance systems

Wireless infrastructure

Defense and aerospace systems

Medical imaging

Product Lifecycle

Status: Active

This product is not nearing discontinuation and has availability for replacements or upgrades

Several Key Reasons to Choose This Product

High integration reduces the complexity and size of the end product

Flexible architecture allows for custom hardware acceleration

Robust connectivity options ensure compatibility with modern communication protocols

Supported by Xilinx's comprehensive development tools for easier design and implementation

Capable of operating in extreme temperatures making it suitable for industrial and automotive applications

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU4EG-1FBVB900E

Product Attribute XCZU4EG-1FBVB900E XCZU4CG-1FBVB900E XCZU4EG-2FBVB900E XCZU4CG-1SFVC784I
Part Number XCZU4EG-1FBVB900E XCZU4CG-1FBVB900E XCZU4EG-2FBVB900E XCZU4CG-1SFVC784I
Manufacturer AMD AMD AMD AMD
Supplier Device Package 900-FCBGA (31x31) 900-FCBGA (31x31) 900-FCBGA (31x31) 784-FCBGA (23x23)
Package Tray Tray Tray Tray
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz 500MHz, 1.2GHz
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Flash Size - - - -
RAM Size 256KB 256KB 256KB 256KB
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 784-BFBGA, FCBGA
Base Product Number XCZU4 XCZU4 XCZU4 XCZU4
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Number of I/O 204 204 204 252
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC CG
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

XCZU4EG-1FBVB900E Datasheet PDF

Download XCZU4EG-1FBVB900E pdf datasheets and AMD documentation for XCZU4EG-1FBVB900E - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU4EG-1FBVB900E

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32D-XCZU4EG-1FBVB900E

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