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HomeProductsIntegrated Circuits (ICs)Embedded - System On Chip (SoC)XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I Image
Image may be representation.
See specifications for product details.

XCZU15EG-2FFVC900I - AMD

Manufacturer Part Number
XCZU15EG-2FFVC900I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCZU15EG-2FFVC900I
ECAD Model
Parts Description
IC SOC CORTEX-A53 900FCBGA
Detailed Description
Package
900-BBGA, FCBGA
Data sheet
XCZU15EG-2FFVC900I.pdf
RoHs Status
ROHS3 Compliant
In stock: 6

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Quantity

Specifications

XCZU15EG-2FFVC900I Tech Specifications
AMD - XCZU15EG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to AMD - XCZU15EG-2FFVC900I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Supplier Device Package 900-FCBGA (31x31)  
Speed 533MHz, 600MHz, 1.3GHz  
Series Zynq® UltraScale+™ MPSoC EG  
RAM Size 256KB  
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells  
Peripherals DMA, WDT  
Package / Case 900-BBGA, FCBGA  
Product Attribute Attribute Value  
Package Tray  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of I/O 204  
Flash Size -  
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2  
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG  
Base Product Number XCZU15  
Architecture MCU, FPGA  

Parts Introduction

Manufacturer Part Number

XCZU15EG-2FFVC900I

Manufacturer

Xilinx

Introduction

High-density embedded System On Chip (SoC) integrating multi-core CPU and FPGA technologies

Product Features and Performance

Combines ARM® processor-based PS and programmable logic (PL) in a single device

Incorporates processing system (PS) with Quad-core ARM® Cortex™-A53 and Dual-core ARM® Cortex™-R5

Integrated FPGA with 747K+ logic cells for custom hardware applications

High-speed connectivity with multiple interfaces

Supports advanced peripheral interfaces and high-speed serial connectivity

Product Advantages

Multifunctional integration suitable for high-performance applications

Energy-efficient design optimized for low-power operations

Adaptable to a wide range of applications due to its flexible architecture

Scalability and longevity supported by the Xilinx ecosystem

Key Technical Parameters

Architecture: MCU, FPGA

Flash Size: Not available (external flash supported)

RAM Size: 256KB on-chip

Peripherals: DMA, WDT

Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Clock Speed: 533MHz, 600MHz, 1.3GHz CPU processors

Primary Attributes: Zynq® UltraScale+™ FPGA technology

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 900-BBGA, FCBGA

Supplier Device Package: 900-FCBGA (31x31)

Number of I/O: 204

Quality and Safety Features

Robust thermal management for reliable operation within specified temperature ranges

Design assurance with Xilinx's high manufacturing and testing standards

Compatibility

Compatible with a range of development tools and software from Xilinx and third-party providers

Supports industry-standard interfaces for seamless integration with existing systems

Application Areas

Suitable for data centers, aerospace and defense, automotive, industrial control, telecommunications, and audio/video applications

Product Lifecycle

Active product status, not nearing discontinuation

Long lifecycle with potential upgrades within the Zynq UltraScale+ series

Several Key Reasons to Choose This Product

Integration of powerful multi-core ARM CPUs and flexible FPGA on a single device offers a high degree of customization

Multiple connectivity options cater to a variety of interface requirements

Robust programmable logic cell count enables implementation of complex digital circuits

Manufactured by Xilinx, a leader in adaptive computing solutions

Strong support ecosystem for ease of development and future scalability

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCZU15EG-2FFVC900I

Product Attribute XCZU15EG-2FFVC900I XCZU19EG-1FFVB1517E XCZU11EG-2FFVC1760E XCZU11EG-1FFVC1760E
Part Number XCZU15EG-2FFVC900I XCZU19EG-1FFVB1517E XCZU11EG-2FFVC1760E XCZU11EG-1FFVC1760E
Manufacturer AMD AMD AMD AMD
Number of I/O 204 644 512 512
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Flash Size - - - -
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Speed 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz 533MHz, 600MHz, 1.3GHz 500MHz, 600MHz, 1.2GHz
Package Tray Tray Tray Tray
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Series Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG Zynq® UltraScale+™ MPSoC EG
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supplier Device Package 900-FCBGA (31x31) 1517-FCBGA (40x40) 1760-FCBGA (42.5x42.5) 1760-FCBGA (42.5x42.5)
Package / Case 900-BBGA, FCBGA 1517-BBGA, FCBGA 1760-BBGA, FCBGA 1760-BBGA, FCBGA
Base Product Number XCZU15 XCZU19 XCZU11 XCZU11

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCZU15EG-2FFVC900I

AMD
32D-XCZU15EG-2FFVC900I

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