Manufacturer Part Number
XCZU19EG-2FFVB1517I
Manufacturer
Xilinx
Introduction
High-performance embedded system on chip designed for advanced applications
Product Features and Performance
Integrated FPGA and MCU architecture
Support for advanced peripherals and high-speed connectivity
Designed for scalability and high-speed signal processing
Multicore processing with ARM Cortex CPUs and Programmable Logic
Product Advantages
Combines the flexibility of programmable logic with the power of a processing system
High logic cell count for complex designs
Advanced security features for data protection
Key Technical Parameters
ARM Cortex CPUs with speeds up to 1.3GHz
1143K+ Logic Cells in FPGA
256KB on-chip RAM
Multiple high-speed connectivity options including Ethernet, USB OTG, CANbus
Operating temperature range from -40°C to 100°C
Quality and Safety Features
Reliable performance in extreme temperatures
Robust ball grid array (BGA) packaging
Compatibility
Compatible with a range of development tools and software from Xilinx
Standard interfaces for easy integration with existing systems
Application Areas
Advanced embedded systems
Industrial automation
Telecommunications
Aerospace and defense
Automotive electronics
Product Lifecycle
Product status is active
Long-term availability with support and updates from Xilinx
Several Key Reasons to Choose This Product
High integration reduces system complexity and BOM cost
Flexible I/O and connectivity for diverse applications
Scalable processing power to meet evolving design requirements
Extended operational temperature suited for harsh environments
Support and resources available from an industry-leading semiconductor manufacturer
XCZU19EG-2FFVB1517E