Manufacturer Part Number
XCZU19EG-2FFVC1760I
Manufacturer
Xilinx
Introduction
High-Performance Embedded System on Chip with comprehensive multi-processing environment
Product Features and Performance
Advanced multi-core heterogeneous processing architecture
Featuring an ARM®Cortex™-A53 based MPCore™ and ARM® Cortex™-R5 based real-time processing unit
Versatile programmable logic for custom hardware acceleration
Up to 1.3GHz processing speed enhances computational capability
Integrates a multi-rate Ethernet MAC supporting up to 100Gbps data rates
High-speed connectivity interfaces
Product Advantages
Effective solution for a wide range of applications including data processing and analytics
Low-power operation with high performance
Scalable and customizable computing platform
Key Technical Parameters
Architecture: MCU, FPGA
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 600MHz, 1.3GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature Range: -40°C to 100°C
I/O Count: 512
Quality and Safety Features
Robust thermal management for reliable operation
Designed for operation in extreme environments
Compatibility
Compliant with multiple industry-standard protocols and interfaces
Application Areas
Data centers
5G telecommunications infrastructure
Aerospace and defense systems
Automotive driver assistance and infotainment
Industrial automation and control systems
Product Lifecycle
Status: Active
Long-term availability with options for future upgrades
Several Key Reasons to Choose This Product
High integration minimizes board complexity and space requirements
Flexible design suited for multiple market segments
Powerful processing capabilities for demanding applications
Long lifecycle with support ensures product longevity
Optimizes total system cost through integrated features and functions