Manufacturer Part Number
XCZU11EG-2FFVC1760E
Manufacturer
Xilinx
Introduction
The XCZU11EG-2FFVC1760E is part of the Zynq® UltraScale+™ MPSoC EG series, combining MCU and FPGA architectures with advanced processing capabilities.
Product Features and Performance
Multi-Core CPU architecture
Advanced FPGA integration for hardware acceleration
High-speed connectivity options including Ethernet and USB OTG
Support for multiple peripherals like DMA and WDT
Product Advantages
High integration reduces board space and system complexity.
Capable of handling complex processing tasks through its FPGA component.
Versatile connectivity options support a wide range of applications.
Key Technical Parameters
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of I/O: 512
Operating Temperature: 0°C ~ 100°C (TJ)
Quality and Safety Features
Built to operate reliably within 0°C to 100°C temperature range.
Compatibility
Compatible with various industrial, automotive, and data processing applications.
Application Areas
Ideal for embedded systems in automotive, data centers, AI computing, and industrial automation.
Product Lifecycle
Active product with ongoing support.
Future upgrade paths available for evolving technological needs.
Several Key Reasons to Choose This Product
Robust processing power with FPGA and multi-core CPU combination.
Enhanced system design flexibility through advanced connectivity and high number of I/Os.
Reliability and durability confirmed for harsh temperature environments from 0°C to 100°C.
Wide application range from automotive systems to data-intensive processing platforms.
