XC3S400-4FGG456C - AMD

Manufacturer Part Number

XC3S400-4FGG456C

Manufacturer

Xilinx

Introduction

The XC3S400-4FGG456C is part of the Spartan®-3 series of FPGAs (Field Programmable Gate Arrays) designed and manufactured by Xilinx, primarily intended for embedded systems.

Product Features and Performance

Contains 896 LABs/CLBs for logic operations.

Equipped with 8,064 Logic Elements/Cells for intricate circuit designs.

Features a total RAM bits of 294,912, facilitating substantial data storage.

Provides 264 I/O pins for versatile connectivity options.

Offers a gate count of 400,000, enabling complex digital logic implementation.

Operates effectively within a voltage supply range of 1.14V to 1.26V.

Designed for surface mount technology, ensuring a compact footprint.

Supports an operating temperature range from 0°C to 85°C.

Product Advantages

High logic capacity and gate count for comprehensive digital designs.

Extensive I/O options for broad peripheral connectivity.

Significant internal RAM facilitates enhanced data handling capabilities.

Low voltage operation for power-efficient designs.

Robust operating temperature range supports deployment in varied environments.

Key Technical Parameters

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8,064

Total RAM Bits: 294,912

Number of I/O: 264

Number of Gates: 400,000

Voltage Supply Range: 1.14V ~ 1.26V

Operating Temperature Range: 0°C ~ 85°C

Quality and Safety Features

Manufactured by Xilinx, a leading name in FPGA technology for quality assurance.

Compliant with industry-standard safety and operational benchmarks.

Compatibility

Surface mount design is compatible with modern PCB assembly processes.

Versatile I/O compatibility for a wide range of peripheral devices.

Application Areas

Ideal for embedded systems, telecommunications, automotive applications, consumer electronics, and industrial control systems.

Product Lifecycle

Classified as "Last Time Buy," indicating the model is nearing discontinuation.

Customers are advised to consult Xilinx for available replacements or upgrades.

Several Key Reasons to Choose This Product

High-density logic elements and considerable gate count cater to complex digital designs.

Extensive I/O and internal RAM support advanced and versatile applications.

Low power consumption aligns with eco-friendly and energy-efficient design criteria.

Surface mount technology compatibility facilitates streamlined manufacturing.

Backed by Xilinx's reputation for reliability and excellence in FPGA designs.