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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S400-4FG456I
XC3S400-4FG456I Image
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See specifications for product details.

XC3S400-4FG456I - AMD

Manufacturer Part Number
XC3S400-4FG456I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S400-4FG456I
ECAD Model
Parts Description
IC FPGA 264 I/O 456FBGA
Detailed Description
Package
456-BBGA
Data sheet
XC3S400-4FG456I.pdf
In stock: 305

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Quantity

Specifications

XC3S400-4FG456I Tech Specifications
AMD - XC3S400-4FG456I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S400-4FG456I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 294912  
Supplier Device Package 456-FBGA (23x23)  
Series Spartan®-3  
Package / Case 456-BBGA  
Package Bulk  
Product Attribute Attribute Value  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of Logic Elements/Cells 8064  
Number of LABs/CLBs 896  
Number of I/O 264  
Number of Gates 400000  
Mounting Type Surface Mount  
Base Product Number XC3S400  

Parts Introduction

Manufacturer Part Number

XC3S400-4FG456I

Manufacturer

Xilinx

Introduction

The XC3S400-4FG456I is part of Xilinx's Spartan®-3 series, designed for high-performance digital signal processing and embedded applications in a compact 456-BBGA package.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array)

896 LABs/CLBs

8064 Logic Elements/Cells

294912 Total RAM Bits

264 I/O ports

400000 Gates

Surface Mount Technology

Product Advantages

Optimized for power efficiency and high-speed processing

Provides a flexible and reconfigurable architecture

Robust support for digital processing and embedded solutions

Key Technical Parameters

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8064

Total RAM Bits: 294912

Number of I/O: 264

Voltage Supply: 1.14V ~ 1.26V

Number of Gates: 400000

Operating Temperature: -40°C ~ 100°C

Quality and Safety Features

High operational temperature range offering reliability under varying environmental conditions

Advance packaging ensures safe and secure application deployment

Compatibility

Compatible with multiple standard voltage and interfacing options

Supports various programming languages and development environments commonly used in digital and embedded systems

Application Areas

Digital signal processing

Embedded systems

High-speed digital interfacing

Complex logic operations

Product Lifecycle

Product Status: Last Time Buy, indicating near end of lifecycle with limited time for purchase

Explore possible alternatives or future upgrades if current stocks are depleted

Several Key Reasons to Choose This Product

High logic gate density for complex digital tasks

Extensive I/O count suitable for multitasking

Stable performance under wide temperature ranges

Reconfigurability enabling post-deployment modifications

Power efficiency aiding in better system design and resource management

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S400-4FG456I

Product Attribute XC3S400-4FG456I XC3S400-4FTG256I XC3S250E-5TQG144C XC3S400-4FTG256C
Part Number XC3S400-4FG456I XC3S400-4FTG256I XC3S250E-5TQG144C XC3S400-4FTG256C
Manufacturer AMD AMD AMD AMD
Package / Case 456-BBGA 256-LBGA 144-LQFP 256-LBGA
Package Bulk Tray Tray Tray
Number of I/O 264 173 108 173
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Series Spartan®-3 Spartan®-3 Spartan®-3E Spartan®-3
Number of LABs/CLBs 896 896 612 896
Total RAM Bits 294912 294912 221184 294912
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Number of Logic Elements/Cells 8064 8064 5508 8064
Base Product Number XC3S400 XC3S400 XC3S250 XC3S400
Number of Gates 400000 400000 250000 400000
Supplier Device Package 456-FBGA (23x23) 256-FTBGA (17x17) 144-TQFP (20x20) 256-FTBGA (17x17)

XC3S400-4FG456I Datasheet PDF

Download XC3S400-4FG456I pdf datasheets and AMD documentation for XC3S400-4FG456I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3S400-4FG456I

AMD
32D-XC3S400-4FG456I

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