XC3S400-4FG320I - AMD

Manufacturer Part Number

XC3S400-4FG320I

Manufacturer

xilinx

Introduction

The XC3S400-4FG320I is a high-performance FPGA from Xilinx's Spartan®-3 series, designed for embedded applications requiring high-speed logic operations. It integrates advanced logic cells, ample RAM, and versatile I/O options in a compact footprint.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array) technology

Advanced logic cells for efficient processing

Ample total RAM bits for storage and operations: 294,912

High I/O pin count: 221 for flexible connectivity

Large gate count (400,000) for complex logic implementations

Designed for surface mount technology

Product Advantages

Offers a balance between performance and cost

Supports a wide range of operating voltages (1.14V ~ 1.26V) for versatile power needs

Operates across a broad temperature range (-40°C ~ 100°C), ensuring reliability in extreme conditions

High integration reduces PCB space and system complexity

Key Technical Parameters

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8,064

Voltage Supply Range: 1.14V ~ 1.26V

Operating Temperature Range: -40°C ~ 100°C (TJ)

Packaging Type: 320-BGA

Mounting Type: Surface Mount

Quality and Safety Features

Rigorous testing under extreme conditions to guarantee performance stability

Compliance with industry standards for safety and quality assurance

Compatibility

Supports a wide array of design tools from Xilinx for easier development

Compatible with various standard digital interfaces for seamless integration into existing systems

Application Areas

Ideal for embedded processing, telecommunications, automotive systems, and consumer electronics where efficiency and compactness are crucial

Product Lifecycle

Currently in the Last Time Buy phase, indicating it is nearing discontinuation

Customers are advised to plan for replacements or upgrades, with information available from Xilinx regarding successor products

Several Key Reasons to Choose This Product

Advanced feature set tailored for complex embedded applications

Strong balance between power, performance, and cost

Broad operating temperature range supporting use in harsh environments

Compact form factor facilitating easier integration into existing systems

Support from Xilinx for transitioning to next-generation products as this model phases out