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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S400-4FTG256I
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XC3S400-4FTG256I - AMD

Manufacturer Part Number
XC3S400-4FTG256I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S400-4FTG256I
ECAD Model
Parts Description
IC FPGA 173 I/O 256FTBGA
Detailed Description
Package
256-LBGA
Data sheet
XC3S400-4FTG256I.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 400

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Specifications

XC3S400-4FTG256I Tech Specifications
AMD - XC3S400-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S400-4FTG256I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 294912  
Supplier Device Package 256-FTBGA (17x17)  
Series Spartan®-3  
Package / Case 256-LBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of Logic Elements/Cells 8064  
Number of LABs/CLBs 896  
Number of I/O 173  
Number of Gates 400000  
Mounting Type Surface Mount  
Base Product Number XC3S400  

Parts Introduction

Manufacturer Part Number

XC3S400-4FTG256I

Manufacturer

Xilinx

Introduction

The XC3S400-4FTG256I is a Spartan®-3 series FPGA designed for embedded applications requiring high-performance logic operations, offered by Xilinx, the leader in FPGAs.

Product Features and Performance

Embedded FPGA with 400000 system gates

896 Logic Blocks/CLBs for flexible logic implementation

8064 configurable Logic Elements/Cells

294912 Total RAM bits for memory applications

173 high-performance I/O pins for interfacing

Low-power 1.14V to 1.26V operation voltage

Operates efficiently at -40°C to 100°C temperature range

Compatible with 256-FTBGA packaging

Product Advantages

High gate density for complex designs

Robust temperature range for use in extreme environments

Optimal power consumption for power-sensitive applications

Key Technical Parameters

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8064

Total RAM Bits: 294912

Number of I/O: 173

Number of Gates: 400000

Voltage Supply: 1.14V ~ 1.26V

Quality and Safety Features

Stringent manufacturing standards ensure high reliability

Long operating temperature range signifies durability

Compatibility

Standard surface mounting compatible with 256-LBGA

Easily integrable with common PCB design techniques

Application Areas

Ideal for embedded systems

Suitable for telecommunications, automotive, and industrial control applications

Product Lifecycle

Product Status: Last Time Buy

Availability of replacements or upgrades subject to manufacturer's guidelines

Several Key Reasons to Choose This Product

Robust feature set suitable for a wide range of applications

Long lifecycle with Last Time Buy notice facilitates long-term support

Designed and manufactured by Xilinx, a renowned leader in FPGA innovation

Low power consumption for energy-efficient designs

Support and resources available from Xilinx for development

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S400-4FTG256I

Product Attribute XC3S400-4FTG256I XC3S400-4PQ208C XC3S400-4FGG456I XC3S400-4FGG320C
Part Number XC3S400-4FTG256I XC3S400-4PQ208C XC3S400-4FGG456I XC3S400-4FGG320C
Manufacturer AMD AMD AMD AMD
Series Spartan®-3 Spartan®-3 Spartan®-3 Spartan®-3
Number of LABs/CLBs 896 896 896 896
Package / Case 256-LBGA 208-BFQFP 456-BBGA 320-BGA
Supplier Device Package 256-FTBGA (17x17) 208-PQFP (28x28) 456-FBGA (23x23) 320-FBGA (19x19)
Base Product Number XC3S400 XC3S400 XC3S400 XC3S400
Number of I/O 173 141 264 221
Total RAM Bits 294912 294912 294912 294912
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Number of Logic Elements/Cells 8064 8064 8064 8064
Number of Gates 400000 400000 400000 400000
Package Tray Tray Tray Tray
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount

XC3S400-4FTG256I Datasheet PDF

Download XC3S400-4FTG256I pdf datasheets and AMD documentation for XC3S400-4FTG256I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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AMD

XC3S400-4FTG256I

AMD
32D-XC3S400-4FTG256I

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