Manufacturer Part Number
XC3S2000-5FG900C
Manufacturer
AMD Xilinx
Introduction
High-performance, cost-effective FPGA for a wide range of embedded applications
Product Features and Performance
2 million system gates
46,080 logic cells
565 user I/O pins
5,120 CLBs (Configurable Logic Blocks)
737,280 total distributed RAM bits
Supports up to 400 MHz system performance
Product Advantages
Flexible and reconfigurable logic
Optimized for power-sensitive embedded applications
Extensive IP core library for faster time-to-market
Key Technical Parameters
Operating voltage: 1.14 V to 1.26 V
Operating temperature: 0°C to 85°C
900-FBGA package (31x31 mm)
RoHS non-compliant, contains lead
Quality and Safety Features
Moisture Sensitivity Level (MSL) 3 (168 hours)
Compatibility
Compatible with AMD Xilinx's Spartan-3 FPGA family
Application Areas
Embedded systems
Industrial automation
Telecommunications
Medical equipment
Consumer electronics
Product Lifecycle
Currently available
Replacements or upgrades may be available in the future
Key Reasons to Choose This Product
High performance and gate count for demanding embedded applications
Flexible and reconfigurable architecture
Extensive IP core library for faster development
Cost-effective solution for power-sensitive designs