Manufacturer Part Number
XC3S2000-4FGG676C
Manufacturer
Xilinx
Introduction
The XC3S2000-4FGG676C is a part of the Spartan®-3 series from Xilinx, which is designed for high-performance embedded Field Programmable Gate Arrays (FPGAs) applications. It is surfaced in a 676-BGA package, optimized for both cost and power efficiency in electronic designs.
Product Features and Performance
High logic capacity with 2M gates and 46,080 logic cells
Build-in 5120 LABs/CLBs for extensive logic processing
Large on-chip memory of 737,280 RAM bits
Supports up to 489 I/O pins for flexible interfacing
Operates on a low voltage supply range of 1.14V to 1.26V
Works within a temperature range of 0°C to 85°C
Product Advantages
High density and performance at a low cost
Supports complex digital systems integration on a single chip
Energy efficient for portable and power-sensitive applications
Wide range of input/output capabilities for versatile connectivity
Key Technical Parameters
Number of LABs/CLBs: 5120
Number of Logic Elements/Cells: 46080
Total RAM Bits: 737280
Number of I/O: 489
Voltage Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Complies with industry-standard quality and reliability requirements
Features built-in safety mechanisms for voltage and temperature protections
Compatibility
Compatible with various Xilinx development tools for easy design-in
Supports standard surface mount technology for PCB integration
Application Areas
Ideal for telecommunications, automotive, industrial control systems, and consumer electronics
Suitable for high-volume applications requiring intensive data processing and high-speed interfacing
Product Lifecycle
Currently in the "Last Time Buy" phase of its lifecycle
Availability of replacements or upgrades might be limited
Reasons to Choose This Product
High-performance FPGA solution from a reputable manufacturer
Cost and power efficiency make it suitable for a wide range of applications
Extensive logic and memory capabilities support sophisticated digital designs
Broad operating temperature range enhances its utility in harsh environments
Transitioning to a new product is manageable due to compatibility with existing Xilinx tools and technologies
XC3S200-FTG256AMD Xilinx
XC3S2000-4FG676CAMDIC FPGA 489 I/O 676FCBGA