XC3S2000-4FG676I - AMD

Manufacturer Part Number

XC3S2000-4FG676I

Manufacturer

Xilinx

Introduction

The XC3S2000-4FG676I is a high-performance FPGA part of the Spartan-3 series, encapsulated in a 676-BGA package designed for advanced embedded systems.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array)

5120 LABs/CLBs

46080 Logic Elements/Cells

737280 Total RAM Bits

489 I/O pins

2 million gates

Supports voltage supply from 1.14V to 1.26V

Surface mount mounting type

Operational temperature range from -40°C to 100°C

Product Advantages

High logic capacity and gate density for complex designs

Extensive input/output capacity facilitating versatile interfacing

Ample memory facilitates sophisticated data management and processing

Robust temperature tolerance ensuring reliability in varying environments

Key Technical Parameters

Number of LABs/CLBs: 5120

Number of Logic Elements/Cells: 46080

Total RAM Bits: 737280

Number of I/O: 489

Number of Gates: 2000000

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Rigorous temperature ratings ensure performance under extreme conditions

BGA packaging ensures reliable soldering and physical integrity

Compatibility

Compatibility with a range of voltage supplies and physical interfacing options due to its diverse I/O count and flexible supply voltage range

Application Areas

Telecommunications

Automotive systems

Consumer electronics

Industrial controls

Aerospace and defense applications

Product Lifecycle

Status: Last Time Buy

Customers should plan for transition as replacements or upgrades might be necessary soon

Several Key Reasons to Choose This Product

Optimal for high-complexity embedded design due to high logic capacity and gate count

Broad applicability across various industries due to versatile features and robust environmental tolerance

Reliable performance supported by robust quality and safety features

Suitable for advanced processing and control tasks in challenging physical and operational environments