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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S2000-5FGG676C
XC3S2000-5FGG676C Image
Image may be representation.
See specifications for product details.

XC3S2000-5FGG676C - AMD

Manufacturer Part Number
XC3S2000-5FGG676C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S2000-5FGG676C
ECAD Model
Parts Description
IC FPGA 489 I/O 676FBGA
Detailed Description
Package
676-BGA
Data sheet
XC3S2000-5FGG676C.pdf
RoHs Status
ROHS3 Compliant
In stock: 196

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Quantity

Specifications

XC3S2000-5FGG676C Tech Specifications
AMD - XC3S2000-5FGG676C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S2000-5FGG676C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 737280  
Supplier Device Package 676-FBGA (27x27)  
Series Spartan®-3  
Package / Case 676-BGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 46080  
Number of LABs/CLBs 5120  
Number of I/O 489  
Number of Gates 2000000  
Mounting Type Surface Mount  
Base Product Number XC3S2000  

Parts Introduction

Manufacturer Part Number

XC3S2000-5FGG676C

Manufacturer

Xilinx

Introduction

Xilinx Spartan-3 FPGA optimized for high-performance logic and RAM utilization

Product Features and Performance

Integrated 737280 RAM bits for advanced data storage options

46080 logic cells for versatile and complex digital circuit implementations

5120 LABs / CLBs for efficient logic distribution

2000000 gate capacity for high-density logic applications

489 I/O pins for extensive interfacing with other components

Surface Mount 676-BGA package suited for compact PCB design

Supports 1.14V to 1.26V power supply range for low-voltage operation

Product Advantages

Robust performance-to-cost ratio for budget-sensitive applications

Proven Spartan Series reliability and performance

Wide compatibility with broad range of digital and mixed-signal components

Key Technical Parameters

Number of LABs/CLBs: 5120

Number of Logic Elements/Cells: 46080

Total RAM Bits: 737280

Number of I/O: 489

Number of Gates: 2000000

Voltage - Supply: 1.14V ~ 1.26V

Quality and Safety Features

Operates within 0°C ~ 85°C temperature range ensuring stable performance in varied environments

Compatibility

Adaptable to numerous digital interfacing requirements through its extensive I/O capacity

Application Areas

Ideal for use in telecommunications, automotive, consumer electronics, and industrial control systems

Product Lifecycle

Last Time Buy status indicating the phase-out of the product

Alternatives or upgrades should be considered for long-term projects

Several Key Reasons to Choose This Product

Highly flexible architecture for diverse application domains

Generous I/O count suitable for complex interfacing tasks

Part of the established Spartan series, assuring a proven design pedigree

Competitive cost-performance ratio for budget-conscious designs

Sufficient logic and memory resources for substantial application complexity

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S2000-5FGG676C

Product Attribute XC3S2000-5FGG676C XC3S2000-5FG456C XC3S200A-4FT256C XC3S200A-4VQG100I
Part Number XC3S2000-5FGG676C XC3S2000-5FG456C XC3S200A-4FT256C XC3S200A-4VQG100I
Manufacturer AMD Xilinx AMD AMD
Number of Logic Elements/Cells 46080 46080 4032 4032
Voltage - Supply 1.14V ~ 1.26V 1.14 V ~ 1.26 V 1.14V ~ 1.26V 1.14V ~ 1.26V
Number of I/O 489 333 195 68
Base Product Number XC3S2000 - XC3S200 XC3S200
Number of Gates 2000000 2000000 200000 200000
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Total RAM Bits 737280 737280 294912 294912
Number of LABs/CLBs 5120 5120 448 448
Supplier Device Package 676-FBGA (27x27) 456-FBGA (23x23) 256-FTBGA (17x17) 100-VQFP (14x14)
Package / Case 676-BGA 456-BBGA 256-LBGA 100-TQFP
Package Tray - Tray Tray
Series Spartan®-3 Spartan®-3 Spartan®-3A Spartan®-3A

XC3S2000-5FGG676C Datasheet PDF

Download XC3S2000-5FGG676C pdf datasheets and AMD documentation for XC3S2000-5FGG676C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3S2000-5FGG676C

AMD
32D-XC3S2000-5FGG676C

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