W988D6FBGX7I - Winbond Electronics

Manufacturer Part Number

W988D6FBGX7I

Manufacturer

Winbond Electronics

Introduction

High-speed mobile SDRAM memory chip designed for applications requiring low power consumption and compact design.

Product Features and Performance

Volatile memory type

DRAM format optimized for mobile usage

Uses SDRAM - Mobile LPSDR technology

256Mbit memory size

Organized as 16M x 16

LVCMOS memory interface

Supports a clock frequency of 133 MHz

Fast write cycle time of 15ns

Quick access time of 5.4 ns

Product Advantages

Low power consumption suitable for mobile devices

High-speed memory allows for smooth performance

Compact TFBGA packaging for space-constrained applications

Key Technical Parameters

Memory Size: 256Mbit

Organization: 16M x 16

Clock Frequency: 133MHz

Write Cycle Time: 15ns

Access Time: 5.4ns

Supply Voltage: 1.7V ~ 1.95V

Quality and Safety Features

Operational across a wide temperature range: -40°C to 85°C

Compatibility

Compatible with devices using LVCMOS interface

Surface Mount technology for PCB assembly

Application Areas

Used in various mobile electronic devices

Product Lifecycle

Obsolete status - manufacturer has discontinued the product

Replacements or upgrades may be limited or unavailable

Several Key Reasons to Choose This Product

Low power consumption enhancing battery life in mobile devices

Quick memory access time for high-performance applications

Operates effectively in extreme temperatures

Compact form factor for space-sensitive devices

Industry-standard LVCMOS interface for wide compatibility