W988D6FBGX6E - Winbond Electronics

Manufacturer Part Number

W988D6FBGX6E

Manufacturer

Winbond Electronics

Introduction

The Winbond W988D6FBGX6E is a high-performance, low-power SDRAM memory chip designed for mobile and embedded applications. It offers a compact 54-TFBGA package and operates at low voltages, making it well-suited for power-sensitive devices.

Product Features and Performance

256Mbit memory size with 16M x 16 organization

Parallel memory interface

166MHz clock frequency

4ns access time

15ns write cycle time

Supports operating voltages from 1.7V to 1.95V

Wide operating temperature range of -25°C to 85°C

Product Advantages

Low power consumption for extended battery life in mobile devices

Compact 54-TFBGA package for space-constrained designs

High-speed performance and low latency for responsive system operation

Robust operating temperature range for use in diverse environments

Key Reasons to Choose This Product

Excellent performance-to-power ratio for optimized mobile and embedded systems

Reliable and proven Winbond quality and technology

Compatibility with a wide range of host processors and system designs

Cost-effective solution for memory requirements in your application

Quality and Safety Features

Rigorous quality control and testing processes

Compliance with industry safety and environmental standards

Compatibility

The W988D6FBGX6E is compatible with a variety of host processors and system designs that require a compact, low-power SDRAM memory solution.

Application Areas

Mobile devices (smartphones, tablets, wearables)

Embedded systems (industrial controllers, IoT devices, automotive electronics)

Other power-sensitive applications that require high-performance memory

Product Lifecycle

The W988D6FBGX6E is an obsolete product, meaning it is no longer in active production. However, there may be equivalent or alternative models available from Winbond Electronics or other memory manufacturers. Customers are advised to contact our website's sales team for more information on current product offerings and suitable replacements.