Manufacturer Part Number
W987D6HBGX6E
Manufacturer
winbond-electronics
Introduction
W987D6HBGX6E is a high-speed SDRAM memory chip designed by Winbond Electronics.
Product Features and Performance
128Mbit SDRAM Mobile LPSDR
High-speed access time of 5.4 ns
Integrated power-saving features for mobile applications
Capable of operating at 166 MHz clock frequency
Parallel memory interface for quick data processing
Product Advantages
Low power consumption for battery-sensitive mobile designs
High data bandwidth for performance-intensive tasks
Compact 54-TFBGA packaging for space-constrained devices
Key Technical Parameters
Memory Size: 128Mbit
Memory Organization: 8M x 16
Clock Frequency: 166 MHz
Write Cycle Time - Word, Page: 15ns
Access Time: 5.4 ns
Voltage - Supply: 1.7V ~ 1.95V
Operating Temperature: -25°C ~ 85°C (TC)
Quality and Safety Features
Tested for a wide range of temperatures ensuring reliability
Surface mount technology for robust physical attachment
Compatibility
Designed for use in devices requiring parallel interface volatile memory
Application Areas
Mobile devices
Portable electronics
High-performance embedded systems
Product Lifecycle
Obsolete status
Potential availability of replacement parts and upgrades
Several Key Reasons to Choose This Product
Optimized for low-power consumption in mobile applications
Fast data access and high bandwidth for demanding applications
Proven reliability across a wide temperature range
Winbond's expertise and reputation in memory technology
Space-saving design with TFBGA packaging
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