SN74LVC2T45DCUR - Texas Instruments

Manufacturer Part Number

SN74LVC2T45DCUR

Manufacturer

Texas Instruments

Introduction

The SN74LVC2T45DCUR is a dual-bit, bidirectional voltage level translator from Texas Instruments designed for mixed-mode signal operation and suitable for use in voltage translation applications where VCCA and VCCB can be as low as 1.65 V and as high as 5.5 V.

Product Features and Performance

Dual-bit bidirectional voltage level translator

Operates from 1.65 V to 5.5 V on both the A and B ports

Supports mixed-mode signal operation

Maximum data rate of 420 Mbps

Non-inverted outputs

Tri-state output feature for increased flexibility in circuit integration

Surface mount package for compact PCB design

Product Advantages

Allows seamless translation between higher and lower logic signal levels

High data rate suitable for fast communication interfaces

Flexible power supply requirements accommodate a variety of system designs

Compact VSSOP packaging saves space on PCBs

Key Technical Parameters

Number of Circuits: 1

Channels per Circuit: 2

Voltage VCCA: 1.65 V ~ 5.5 V

Voltage VCCB: 1.65 V ~ 5.5 V

Data Rate: 420Mbps

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Robust operating temperature range ensuring reliability in extreme conditions

Manufactured by Texas Instruments, a leader in semiconductor innovation

Compatibility

Compatible with a myriad of higher and lower voltage logic interface applications

Application Areas

Mixed-voltage system environments

Data communication systems

Signal bridging applications across different voltage domains

Product Lifecycle

Current Product Status: Active

No indication of nearing discontinuation; availability of replacements or upgrades not specified

Several Key Reasons to Choose This Product

High data rate capability makes it ideal for fast-operating digital interfaces

Wide operating voltage range offers versatility in different electrical environments

Bidirectional channels allow information flow in both directions, increasing design flexibility

Tri-state outputs enable connection to a shared data bus, enhancing circuit integration

Surface mount packaging aligns with modern compact and efficient PCB design requirements