Manufacturer Part Number
EP3SL200F1152I3N
Manufacturer
intel
Introduction
EP3SL200F1152I3N is an embedded FPGA from Intel's Stratix® III L series, designed for high-performance and high-density digital applications.
Product Features and Performance
8000 LABs/CLBs for flexible logic implementation
200,000 Logic Elements/Cells enabling complex circuit designs
10,901,504 Total RAM Bits for extensive data management
744 I/O pins for high connectivity
Supports voltage supply between 0.86V ~ 1.15V
Operates efficiently at temperatures from -40°C to 100°C
Compatible with 1152-BBGA, FCBGA packaging for robust mounting
Product Advantages
High logic capacity and I/O count improve system integration.
Extended temperature range enhances reliability in varying environments.
Compact 1152-FBGA packaging aids in space conservation on PCBs.
Key Technical Parameters
Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 200000
Total RAM Bits: 10901504
Number of I/O: 744
Voltage Supply: 0.86V ~ 1.15V
Operating Temperature: -40°C ~ 100°C (TJ)
Quality and Safety Features
Operates reliably within industrial temperature ranges.
Manufactured adhering to stringent safety and quality standards of intel
Compatibility
Package compatible with standard surface-mount technology.
Application Areas
Telecommunications
Data processing
Industrial applications
Automotive systems
Consumer electronics
Product Lifecycle
Obsolete status indicates discontinuation with potential availability of upgrades or replacements.
Several Key Reasons to Choose This Product
High performance and logic density suitable for complex applications.
Wide operating temperature range assures performance in extreme conditions.
Large number of I/Os facilitating extensive connectivity for various applications.
Produced by Intel, ensuring cutting-edge technology and reliable performance.
EP3SL150F780I4NIntelIC FPGA 488 I/O 780FBGA
EP3SL200H780I3IntelIC FPGA 488 I/O 780HBGA