EP3SL200F1152I3N - Intel

Manufacturer Part Number

EP3SL200F1152I3N

Manufacturer

intel

Introduction

EP3SL200F1152I3N is an embedded FPGA from Intel's Stratix® III L series, designed for high-performance and high-density digital applications.

Product Features and Performance

8000 LABs/CLBs for flexible logic implementation

200,000 Logic Elements/Cells enabling complex circuit designs

10,901,504 Total RAM Bits for extensive data management

744 I/O pins for high connectivity

Supports voltage supply between 0.86V ~ 1.15V

Operates efficiently at temperatures from -40°C to 100°C

Compatible with 1152-BBGA, FCBGA packaging for robust mounting

Product Advantages

High logic capacity and I/O count improve system integration.

Extended temperature range enhances reliability in varying environments.

Compact 1152-FBGA packaging aids in space conservation on PCBs.

Key Technical Parameters

Number of LABs/CLBs: 8000

Number of Logic Elements/Cells: 200000

Total RAM Bits: 10901504

Number of I/O: 744

Voltage Supply: 0.86V ~ 1.15V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Operates reliably within industrial temperature ranges.

Manufactured adhering to stringent safety and quality standards of intel

Compatibility

Package compatible with standard surface-mount technology.

Application Areas

Telecommunications

Data processing

Industrial applications

Automotive systems

Consumer electronics

Product Lifecycle

Obsolete status indicates discontinuation with potential availability of upgrades or replacements.

Several Key Reasons to Choose This Product

High performance and logic density suitable for complex applications.

Wide operating temperature range assures performance in extreme conditions.

Large number of I/Os facilitating extensive connectivity for various applications.

Produced by Intel, ensuring cutting-edge technology and reliable performance.