EP3SL200F1152C3N - Intel

Manufacturer Part Number

EP3SL200F1152C3N

Manufacturer

Intel

Introduction

EP3SL200F1152C3N is a high-performance FPGA from Intel's Stratix® III L series, designed for embedded applications.

Product Features and Performance

Embedded FPGA with 200,000 Logic Elements/Cells

Features 8,000 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs)

Total RAM Bits of 10,901,504

Provides 744 I/O pins

Surface Mount Packaging

Product Advantages

High logic density and comprehensive I/O support enhance the versatility in complex designs

Broad integration capabilities in embedded applications

Key Technical Parameters

Logic Elements/Cells: 200,000

LABs/CLBs: 8,000

Total RAM Bits: 10,901,504

Number of I/O: 744

Supply Voltage Range: 0.86V ~ 1.15V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Operates reliably within a 0°C to 85°C temperature range

Robust 1152-BBGA, FCBGA packaging protects the device in harsh environments

Compatibility

Compatible with surface mount technology for efficient assembly and integration into various applications

Application Areas

Ideal for embedded systems across various industries like telecommunications, automotive, and industrial automation

Product Lifecycle

Status: Obsolete

Availability of replacements or upgrades should be considered as this model is nearing discontinuation

Several Key Reasons to Choose This Product

High density of logic elements facilitates complex logic circuits

Extensive RAM and I/O capabilities accommodate a broad range of functionalities

Supports wide voltage supply range enhancing flexibility in power-sensitive applications

Suitable for demanding operating environments with robust temperature and packaging specifications